Wei Ling Chang, 50Los Angeles, CA

6896929, May 24, 2005

Aug 3, 2001

09/922352

Sanjay Yadav - Redwood City CA, US
Quanyuan Shang - Saratoga CA, US
Ernst Keller - Sunnyvale CA, US
Wei Chang - Los Altos CA, US

Applied Materials, Inc. - Santa Clara CA

C23C016/00

4272481, 427294, 118728

Provided herein is a method of improving the planarity of a support plate of a susceptor for use during deposition of a film of material onto a substrate comprising the steps of reducing pressure in a hollow core of a shaft to a level below atmospheric pressure; and reducing a pressure in the deposition chamber to a level required for the deposition of the film of material onto the substrate, where the pressure in the hollow core of the shaft acts upon a lower surface of the support plate connected to the shaft and interfacing with the hollow core of the shaft and the pressure in the deposition chamber acts upon an upper surface of the support plate adapted to support the substrate thereby improving planarity. Also provided are a susceptor and a method of depositing a film onto a substrate affixed to the susceptor of the present invention.

2006000, Jan 12, 2006

Jun 2, 2005

11/143506

John White - Hayward CA, US
Emanuel Beer - San Jose CA, US
Wei Chang - Los Altos CA, US
Robin Tiner - Santa Cruz CA, US
Soo Choi - Fremont CA, US

C23C 16/00
C23F 1/00

118728000, 156345510, 11872300R

An apparatus and method for shaping profiles of a large-area PECVD electrode is provided. A plasma-enhanced CVD chamber for processing a large-area substrate is first provided. The chamber includes a lower electrode that supports a large area substrate. The lower electrode is shaped to selectively conform the supported substrate in a selected orientation under operating conditions. The orientation may be either planar or nonplanar. The substrate complies with the shape of the electrode so the substrate is substantially parallel to an upper electrode in the chamber, and/or to a gas diffusion plate in the chamber. The lower electrode comprises a substrate support fabricated from a material of insufficient strength to support itself at operating temperatures and pressure in the chamber. The shape of the substrate support is adjusted by modifying the dimensions and/or planarity of a supporting base structure, and/or by appropriately varying the thickness of the substrate support.

2015030, Oct 22, 2015

Aug 12, 2014

14/457706

- Milpitas CA, US
Jaydeep Sinha - Livermore CA, US
Wei Chang - Foster City CA, US
Krishna Rao - San Ramon CA, US

G06N 7/00
G06N 99/00
G01B 21/00

Predictive modeling based focus error prediction method and system are disclosed. The method includes obtaining wafer geometry measurements of a plurality of training wafers and grouping the plurality of training wafers to provide at least one training group based on relative homogeneity of wafer geometry measurements among the plurality of training wafers. For each particular training group of the at least one training group, a predictive model is develop utilizing non-linear predictive modeling. The predictive model establishes correlations between wafer geometry parameters and focus error measurements obtained for each wafer within that particular training group, and the predictive model can be utilized to provide focus error prediction for an incoming wafer belonging to that particular training group.