William Reimann resumes & CV records
Resumes
William Reimann
William Reimann
William L Reimann Deceased12565 13Th St, Yucaipa, CA 92399
William Reimann Phones & Addresses
12565 13Th St, Yucaipa, CA 92399 909-7958691 909-7959553
Banning, CA
Paramount, CA
Mentone, CA
Mentions for William L Reimann
Publications & IP owners
Us Patents
Method For Forming A High Density Printed Wiring Board
US Patent:
4591411, May 27, 1986
Filed:
Jul 31, 1984
Appl. No.:
6/636783
Inventors:
William G. Reimann - Los Angeles CA
Assignee:
Hughes Aircraft Company - Los Angeles CA
International Classification:
H01L 21306
H01L 21312
H01L 21312
US Classification:
156634
Abstract:
Feed-through vias (38) of 8 mil and smaller diameter are placed on 25 mil centers or smaller so that the feed-through vias serve only as electrical connections and do not block channels between conductors (24a and 42a). The method for forming such feed-through vias and interconnections utilizes a metallic resist (36 and 40) which covers the feed-through vias so that the metallic resist, along with conventional photoresist material, prevent undesired etching of the feed-through vias even in the event of misregistration of the photoresist material.
Buried Resist Technique For The Fabrication Of Printed Wiring
US Patent:
4312897, Jan 26, 1982
Filed:
Jun 9, 1980
Appl. No.:
6/157595
Inventors:
William G. Reimann - Los Angeles CA
Assignee:
Hughes Aircraft Company - Culver City CA
International Classification:
H05K 342
H05K 318
H05K 318
US Classification:
427 96
Abstract:
Narrow conductors and narrow spaces therebetween, typically two or three mils wide, are fabricated on outer layers of a printed wiring board with built-up areas such as plated-through holes or conductors of widths greater than two or three mils. Gold is deposited over a copper clad substrate in a pattern defining the desired circuitry. Thereafter, solder is placed at the built-up areas and, using both the solder and the gold as resist or masks, the exposed copper is removed by etching. An organic resist material is used in lieu of solder when the built-up area comprises wide conductors or leads, e. g. , power busses.
High Density Printed Wiring Board
US Patent:
4663497, May 5, 1987
Filed:
Feb 3, 1986
Appl. No.:
6/825126
Inventors:
William G. Reimann - Los Angeles CA
Assignee:
Hughes Aircraft Company - Los Angeles CA
International Classification:
H05K 100
US Classification:
174 685
Abstract:
Feed-through vias (38) of 8 mil and smaller diameter are placed on 25 mil centers or smaller so that the feed-through vias serve only as electrical connections and do not block channels between conductors (24a and 42a). The method for forming such feed-through vias and interconnections utilizes metallic resist (36 and 40) which covers the feed-through vias so that the metallic resist, along with conventional photoresist material, prevent undesired etching of the feed-through vias even in the event of misregistration of the photoresist material.
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