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John L Baird Deceased275 Neighborhood Way UNIT 226, Sparks, NV 89441

John Baird Phones & Addresses

Sparks, NV   

10177 Floriade Dr, Scottsdale, AZ 85260   

9043 Friess Dr, Scottsdale, AZ 85260   

6427 Gold Dust Ave, Paradise Valley, AZ 85253   

1138 S 98Th St, Mesa, AZ 85208    480-6685863   

Maricopa, AZ   

8300 E Mcdowell Rd UNIT 2075, Scottsdale, AZ 85257   

Mentions for John L Baird

Career records & work history

Lawyers & Attorneys

John Baird Photo 1

John F. Baird, Phoenix AZ - Lawyer

Office:
Snell & Wilmer L.L.P.
400 East Van Buren Street, Suite 1900, Phoenix, AZ 85004
Phone:
602-3826397 (Phone)
Specialties:
Commercial Finance, Government Relations, Office, Industrial, Retail, Mixed Use & Medical, Real Estate
ISLN:
914439293
Admitted:
1999, Arizona, United States District Court, District of Arizona, United States Court of Appeals, Ninth Circuit
University:
Old Dominion University (B.A., 1991, M.S., 1992), Articles Editor, 1998-1999, Staff Member, 1997-1998, University of Kansas Law Review
Law School:
University of Kansas, J.D., 1999
Links:
Site
Biography:
John Baird's practice is concentrated in the area of real estate transactions, including work on behalf of sellers, buyers, landlords, tenants, and investors in a wide variety of transactions involvin...
John Baird Photo 2

John Baird - Lawyer

Office:
John D. Baird
Specialties:
Domestic Relations, Probate
ISLN:
909303578
Admitted:
1975
University:
University of Tulsa, B.S., 1970
Law School:
University of Tulsa, J.D., 1975
John Baird Photo 3

John Baird - Lawyer

Specialties:
Bankruptcy, Building and Construction, Commercial, Corporations Law, Equity
ISLN:
921970789
Admitted:
1979
University:
University of Sydney, B.A.
Law School:
University of Sydney, LL.B.
John Baird Photo 4

John Baird - Lawyer

Office:
John Baird
Specialties:
Real Estate, Wills, Estate Planning, Probate, Litigation, Real Property Law, Bankruptcy Law, Appeals, Banking, General Practice, Government
ISLN:
909303608
Admitted:
1970
University:
University of Missouri, B.S., 1968
Law School:
University of Missouri, J.D., 1970
John Baird Photo 5

John Baird - Lawyer

Office:
Hodgkinson McInnes Pappas
Specialties:
Electrical Patents, Mechanical Patents, Engineering Law, Maritime Communication, Weapon and Propulsion Systems
ISLN:
917650701
University:
Cornell University, B.S., 1998

Medicine Doctors

John S. Baird

Specialties:
Internal Medicine
Work:
Northwestern Medicine Regional Medical Group
885 Roosevelt Rd STE 201, Glen Ellyn, IL 60137
630-3846330 (phone) 630-5453769 (fax)
Site
Education:
Medical School
Loyola University Chicago Stritch School of Medicine
Graduated: 2006
Procedures:
Arthrocentesis, Destruction of Benign/Premalignant Skin Lesions, Electrocardiogram (EKG or ECG), Pulmonary Function Tests, Vaccine Administration
Conditions:
Acute Sinusitis, Anxiety Phobic Disorders, Diabetes Mellitus (DM), Hemorrhoids, Hypothyroidism, Osteoarthritis, Spinal Stenosis, Abdominal Hernia, Acne, Acute Bronchitis, Acute Pharyngitis, Acute Renal Failure, Acute Upper Respiratory Tract Infections, Alcohol Dependence, Alopecia Areata, Alzheimer's Disease, Anal Fissure, Anemia, Angina Pectoris, Atherosclerosis, Atrial Fibrillation and Atrial Flutter, Attention Deficit Disorder (ADD), Benign Paroxysmal Positional Vertigo, Benign Prostatic Hypertrophy, Benign Thyroid Diseases, Bipolar Disorder, Bronchial Asthma, Calculus of the Urinary System, Candidiasis, Cardiomyopathy, Carpel Tunnel Syndrome, Cholelethiasis or Cholecystitis, Chronic Bronchitis, Chronic Fatigue Syndrome, Chronic Renal Disease, Cirrhosis, Constipation, Contact Dermatitis, Dementia, Dermatitis, Disorders of Lipoid Metabolism, Diverticulitis, Diverticulosis, Erectile Dysfunction (ED), Fractures, Dislocations, Derangement, and Sprains, Gastritis and Duodenitis, Gastroesophageal Reflux Disease (GERD), Gastrointestinal Hemorrhage, Genital HPV, Gout, Heart Failure, Herpes Simplex, Herpes Zoster, Hypertension (HTN), Hyperthyroidism, Infectious Liver Disease, Inflammatory Bowel Disease (IBD), Inguinal Hernia, Internal Derangement of Knee Cartilage, Intervertebral Disc Degeneration, Iron Deficiency Anemia, Irritable Bowel Syndrome (IBS), Ischemic Bowel Disease, Ischemic Heart Disease, Ischemic Stroke, Lateral Epicondylitis, Melanoma, Migraine Headache, Multiple Sclerosis (MS), Obsessive-Compulsive Disorder (OCD), Obstructive Sleep Apnea, Osteoporosis, Otitis Media, Overweight and Obesity, Pelvic Inflammatory Disease (PID), Peripheral Nerve Disorders, Plantar Fascitis, Plantar Warts, Pneumonia, Prostatitis, Psoriasis, Pulmonary Embolism, Raynaud's Disease, Restless Leg Syndrome, Rheumatoid Arthritis, Rotator Cuff Syndrome and Allied Disorders, Sarcoidosis, Schizophrenia, Scoliosis or Kyphoscoliosis, Skin and Subcutaneous Infections, Skin Cancer, Substance Abuse and/or Dependency, Systemic Lupus Erythematosus, Tempromandibular Joint Disorders (TMJ), Tension Headache, Thyroiditis, Tinea Pedis, Transient Cerebral Ischemia, Urinary Incontinence, Urinary Tract Infection (UT), Venous Embolism and Thrombosis, Ventral Hernia, Viral Meningitis, Vitamin D Deficiency
Languages:
English
Description:
Dr. Baird graduated from the Loyola University Chicago Stritch School of Medicine in 2006. He works in Glen Ellyn, IL and specializes in Internal Medicine. Dr. Baird is affiliated with Central Dupage Hospital and Delnor Community Hospital.

John B. Baird

Specialties:
Cardiovascular Disease, Internal Medicine
Work:
Missouri Cardiovascular SpecsMissouri Cardiovascular Specialist
1605 E Broadway STE 300, Columbia, MO 65201
573-2567700 (phone) 573-2563003 (fax)
Site
Barnes Jewish Christian MedicalBoone Infectious Diseases
1605 E Broadway STE 110, Columbia, MO 65201
573-8152211 (phone) 573-8152205 (fax)
Site
Education:
Medical School
Washington University School of Medicine
Graduated: 1987
Procedures:
Cardiac Catheterization, Cardiac Stress Test, Cardioversion, Continuous EKG, Echocardiogram, Electrocardiogram (EKG or ECG), Pacemaker and Defibrillator Procedures, Vaccine Administration
Conditions:
Atrial Fibrillation and Atrial Flutter, Cardiomyopathy, Heart Failure, Paroxysmal Supreventricular Tachycardia (PSVT), Acute Myocardial Infarction (AMI), Acute Renal Failure, Anemia, Angina Pectoris, Aortic Regurgitation, Aortic Valvular Disease, Atherosclerosis, Cardiac Arrhythmia, Cholelethiasis or Cholecystitis, Chronic Renal Disease, Conduction Disorders, Congenital Anomalies of the Heart, Constipation, Diabetes Mellitus (DM), Disorders of Lipoid Metabolism, Endocarditis, Esophagitis, Gastrointestinal Hemorrhage, Hemorrhagic stroke, Hypertension (HTN), Hyperthyroidism, Hypothyroidism, Iron Deficiency Anemia, Ischemic Heart Disease, Ischemic Stroke, Mitral Stenosis, Mitral Valvular Disease, Obstructive Sleep Apnea, Osteomyelitis, Overweight and Obesity, Pericardidtis, Pneumonia, Pulmonary Embolism, Septicemia, Skin and Subcutaneous Infections, Substance Abuse and/or Dependency, Thoracid Aortic Aneurysm, Transient Cerebral Ischemia, Urinary Tract Infection (UT), Valvular Heart Disease, Venous Embolism and Thrombosis
Languages:
English, Spanish
Description:
Dr. Baird graduated from the Washington University School of Medicine in 1987. He works in Columbia, MO and 1 other location and specializes in Cardiovascular Disease and Internal Medicine. Dr. Baird is affiliated with Boone Hospital Center.
John Baird Photo 6

John McCowan Baird

Specialties:
Family Medicine
Education:
University of Louisville(1953)
John Baird Photo 7

John M Baird

Specialties:
Urology
John Baird Photo 8

John Richard Baird

Specialties:
Physical Medicine & Rehabilitation
Family Medicine
Internal Medicine
Preventive Medicine
Education:
University of Louisville(1992)
John Baird Photo 9

John Robert Baird

Specialties:
Family Medicine
Education:
Washington University at St. Louis (1978)

License Records

John Sanford Baird Jr.

Licenses:
License #: 100007
Category: Psychologist
Issued Date: Jun 14, 1972

John M. Baird

Licenses:
License #: 11560 - Expired
Category: None on File
Type: Retired

Publications & IP owners

Us Patents

Low-Profile Ball-Grid Array Semiconductor Package

US Patent:
5541450, Jul 30, 1996
Filed:
Nov 2, 1994
Appl. No.:
8/333188
Inventors:
Tim Jones - Chandler AZ
Denise Ommen - Phoenix AZ
John Baird - Scottsdale AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H01L 2348
H01L 2352
US Classification:
257697
Abstract:
A ball-grid array (BGA) semiconductor package (10,60,90) includes a substrate (31,61,91) attached to a support substrate (32,62 92). The substrate (31,61,91) has an opening (33) extending from an upper surface to a lower surface. An integrated circuit chip (18) is attached to the support substrate (32,62,92) within the opening (33). Bond pads (22) on the integrated circuit chip (18) are electrically connected to ball pads (42,73,106,108) on the lower surface of the substrate (31,61,91). Conductive solder balls (26) are attached to the ball pads (42,73,106,108). The support substrate (32,62,92) provides a low profile and functions as a standoff that limits the collapse of the conductive solder balls (26) when the BGA semiconductor package (10,60,90) is attached to an application board (46).

Apparatus For Encapsulating A Semiconductor Device

US Patent:
5118271, Jun 2, 1992
Filed:
Feb 22, 1991
Appl. No.:
7/658817
Inventors:
John Baird - Scottsdale AZ
James H. Knapp - Gilbert AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
B29C 3910
B29C 4102
US Classification:
425116
Abstract:
An elastic material covering an outer surface of a cavity plate but not covering any clamping surfaces of the cavity plate or the inner surface of the cavity plate is used to eliminate use of a dam bar in a lead frame. In an embodiment in accordance with the present invention the elastic material provides a supplementary seal to the clamping surfaces of the cavity plate and a primary seal in spaces between leads of the encapsulated lead frame. In a method of using the present invention, the elastic material is placed between the mold base and the cavity plate. A semiconductor lead frame to be encapsulated is placed in cavities provided by the cavity plate. The mold is closed so that clamping surfaces of the cavity plate clamp directly onto the leads. The elastic material deforms under pressure to compensate for any dimensional variations of the mold plates or lead frame and completely seals the space between leads.

Encapsulation Means And Method For Reducing Flash

US Patent:
4615857, Oct 7, 1986
Filed:
Nov 30, 1984
Appl. No.:
6/676759
Inventors:
John Baird - Scottsdale AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
B29C 3320
B29C 3910
US Classification:
26427217
Abstract:
Injection or transfer molding of plastic is performed in a manner that virtually eliminates flash. Deflection of the mold press is measured with the mold press in a clamping configuration. Then the support structure of the molds is arranged to apply an equal force to the mold face by configuring supporting pillars and bars such that they act as individual springs. Their spring constants and/or lengths are calculated to account for the actual deflection found in the mold press, thereby, producing a uniform pressure on the molds during clamping of the press.

Molding Pot Having Configured Bottom

US Patent:
5123826, Jun 23, 1992
Filed:
Feb 13, 1990
Appl. No.:
7/479501
Inventors:
John Baird - Scottsdale AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
B29C 4502
US Classification:
4251291
Abstract:
A molding apparatus for encapsulating devices and having a molding pot wherein the pot has a configured bottom is provided. The configured bottom serves as a shearing force against encapsulating material pellets which are pressed into the configured bottom by a plunger. The shearing force increases the fluidizing action of the pellets thereby lowering the viscosity of the encapsulating material so it easily enters cavities provided in the molding assembly and completely fills the cavities and encapsulates the devices without damage to the devices.

Plastic Encapsulated Microelectronic Device And Method

US Patent:
5535510, Jul 16, 1996
Filed:
Jun 2, 1995
Appl. No.:
8/459142
Inventors:
Samuel J. Anderson - Tempe AZ
John Baird - Scottsdale AZ
Martin A. Kalfus - Scottsdale AZ
Assignee:
Motorola Inc. - Schaumburg IL
International Classification:
H05K 334
US Classification:
29840
Abstract:
An encapsulated microelectronic device (100) including a base (101) and a semiconductor device (305) having a top and a bottom. The bottom is attached to the base (101). The semiconductor device (105) has a thickness in the range from one-fourth to three-fourths of a millimeter and has a bottom metallization consisting of aluminum (407)/chromium (405)/nickel (403)/gold (401). The semiconductor device (305) has a contact (115) attached to the top. The encapsulated microelectronic device (100) has a molded top (120) surrounding the semiconductor device (305). The molded top (120) is made from low stress molding material.

Semiconductor Package

US Patent:
5252783, Oct 12, 1993
Filed:
Feb 10, 1992
Appl. No.:
7/833223
Inventors:
John Baird - Scottsdale AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H01L 2328
US Classification:
174 522
Abstract:
A semiconductor package is provided having a die attach flag (12) with integral flanges (13) which prevent high pressure plastic encapsulant (18) from escaping or entering between the die attach flag (12) and a mold cavity plate (15) during encapsulation. The die attach flag (12) is held flush against the cavity plate (15) by the packing pressure of the encapsulant (18) during low pressure stages of the encapsulation process. Plastic flowing along the flange (13) solidifies more rapidly than plastic in the body of the semiconductor package, thereby damming plastic flow at the edges of the die attach flag (12) during high pressure stages of the encapsulation process.

Resilient Mold Assembly

US Patent:
5059105, Oct 22, 1991
Filed:
Oct 23, 1989
Appl. No.:
7/425152
Inventors:
John Baird - Scottsdale AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
B29C 3910
US Classification:
425116
Abstract:
A resilient sheet of material is used between a cavity plate and a mold base in a sytem used to encapsulate items such as semiconductor devices. The resilient sheet of material compensates for any dimensional variations in the cavity plates. In addition, compensation is also made for dimensional variations of the item being encapsulated. In one embodiment, the sheet of resilient material is used to seal cavity openings in the cavity plate. A method for the use of such an arrangement is also provided.

Molding Handling Aid

US Patent:
5040965, Aug 20, 1991
Filed:
Mar 23, 1990
Appl. No.:
7/498118
Inventors:
John Baird - Scottsdale AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
B29C 3330
US Classification:
425186
Abstract:
A mold handling aid is provided to assist in moving of a heavy mold on a platen of a mold press. Rollers are placed on the mold itself and engage the platen until the mold reaches its final mounting position on the platen. At this time an air bearing is used to precisely position the mold. In this manner the rollers do not bear any load once a mold is in its final position on the platen.

Isbn (Books And Publications)

Profile Of A Hero: The Story Of Absalom Baird, His Family, And The American Military Tradition

Author:
John A. Baird
ISBN #:
0805924604

The Dynamics Of Organizational Communication

Author:
John E. Baird
ISBN #:
0060404493

Speaking For Results: Communication By Objectives

Author:
John E. Baird
ISBN #:
0060404574

Conducting Church Meetings

Author:
John E. Baird
ISBN #:
0687316820

Group Communication: The Essence Of Synergy

Author:
John E. Baird
ISBN #:
0697041816

Communication: The Essence Of Group Synergy

Author:
John E. Baird
ISBN #:
0697041190

Communication For Business And The Professions

Author:
John E. Baird
ISBN #:
0697041662

Communication For Business And The Professions

Author:
John E. Baird
ISBN #:
0697086283

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