Yan I Zhang, 51New York, NY

6950979, Sep 27, 2005

Mar 20, 2003

10/393706

Yan Zhang - Cupertino CA, US
Tibor Boros - San Francisco CA, US

Arraycomm Inc. - San Jose CA

H03M013/00

714801

In one embodiment of the present invention, the efficiency of an encoder can be maintained while reducing the complexity of a decoder. In one embodiment, the invention includes a communication system in which a transmitter has a pipelined encoder that includes a controller that does not access a look-up table to encode a block of data bits into a binary codeword, and in which a receiver has a decoder to receive the binary codeword after transmission through a communications medium, and to correct an error in the binary codeword introduced during transmission without using a look-up table.

7161522, Jan 9, 2007

Sep 20, 2005

11/231310

Shirish A. Altekar - Los Gatos CA, US
Ting Zhou - Alameda CA, US
Ju Hi John Hong - San Jose CA, US
Jorge Licona Nunez - Santa Clara CA, US
Yan Zhang - Cupertino CA, US

LSI Logic Corporation - Milpitas CA

H03M 1/12

341155, 369 5922

An apparatus comprising an analog-to-digital converter, a compensation circuit, a partial response equalizer and a non-adaptive Viterbi decoder. The analog-to-digital converter may be configured to convert an input analog signal into a digital signal. The compensation circuit may be configured to generate an output signal by clipping the digital signal. The partial response equalizer circuit may be configured to shape the output signal into a pre-defined target with a delay operator. The decoder may be configured to calculate a minimum error between data in the output signal and other possible data sequences.

7334179, Feb 19, 2008

Aug 16, 2004

10/919138

Yan Zhang - Cupertino CA, US
Paul Yang Lu - Los Altos CA, US
Yue Chen - Fremont CA, US

Broadcom Corporation - Irvine CA

G11C 29/42

714764, 714763, 714773

A method and system for ensuring data integrity in a data processing system may comprise monitoring when data for a specified device is available for error correction code generation, and receiving a first indication of the specified device, a second indication of the data, and a third indication of a size of the data during the monitoring. A new error correction code may be generated in hardware for the data based on the indicated size of the data and an indication may be provided to signal when generation of the new error correction code for a specified number of accesses for at least a portion of the data is complete. Detected errors may be corrected in software based on the newly generated error correction code. The first indication may be a device selection signal and the error correction code generation may be enabled or disabled via an enable signal.

7446676, Nov 4, 2008

May 5, 2006

11/418658

Yan Zhang - Cupertino CA, US

Broadcom Corporation - Irvine CA

H03M 11/00

341 24, 341 22, 341 26

Various embodiments are disclosed relating to a self-scan programmable keypad interface. In an example embodiment, an apparatus is provided that includes a processor, and a keypad interface circuit. The keypad interface circuit may include a detection circuit to detect when one or more keys of a keypad have been pressed, a scan circuit adapted to generate signals for keypad scan to identify one or more keys that have been pressed, a debounce circuit to debounce signals, and a key status register adapted to store a status of one or more keys of the keypad obtained during keypad scan. The processor is adapted to read contents of the key status register to identify one or more pressed keys upon receiving a signal from the keypad interface circuit.

7627841, Dec 1, 2009

Apr 12, 2007

11/787108

Ali Shakouri - Santa Cruz CA, US
Travis Kemper - Mission Viejo CA, US
Yan Zhang - Santa Cruz CA, US
Peyman Milanfar - Menlo Park CA, US
Xi Wang - Santa Cruz CA, US

The Regents of the University of California, Santa Cruz - Oakland CA

G06F 17/50
H01L 21/66

716 4, 438 17

The temperature distribution associated with a design of an integrated circuit is calculated by convoluting a surface power usage represented by a power matrix with a heat spreading function. The heat spreading function may be calculated from a simulation of a point source on the integrated circuit using a finite element analysis model of the integrated circuit or other techniques. To account for spatial variations on the chip, the heat spreading function may be made dependent on position using a position scaling function. Steady-state or transient temperature distributions may be computed by using a steady-state or transient heat spreading function. A single heat spreading function may be convolved with various alternative power maps to efficiently calculate temperature distributions for different designs. In an inverse problem, one can calculate the power map from an empirically measured temperature distribution and a heat spreading function using various de-convolution techniques. While the forward problem is analogous to image blurring, the inverse problem is analogous to image restoration.

8335960, Dec 18, 2012

Feb 5, 2008

12/026107

Yan Zhang - Cupertino CA, US
Paul Yang Lu - Los Altos CA, US
Yue Chen - Fremont CA, US

Broadcom Corporation - Irvine CA

H03M 13/00

714752, 714763, 714758

Systems and methods for ensuring data integrity in a data processing system are disclosed. The method may include monitoring when data for a specified device is available for error correction code generation. A new error correction code may be generated in hardware for the data, based on the indicated size of the data. Detected errors may be corrected in software, based on the generated new error correction code. A first indication of the specified device, a second indication of the data and a third indication of a size of the data may be received during the monitoring. The method may also include indicating when the generating of the new error correction code for a specified number of accesses for at least a portion of the data is complete, and enabling or disabling the error correction code generation. The enabling and/or the disabling may be accomplished via an enable signal.

8411407, Apr 2, 2013

Nov 10, 2009

12/615909

Nels Jewell-Larsen - Campbell CA, US
Kenneth A. Honer - Santa Clara CA, US
Matt Schwiebert - San Jose CA, US
Hongyu Ran - Mountain View CA, US
Piyush Savalia - San Jose CA, US
Yan Zhang - San Jose CA, US

Tessera, Inc. - San Jose CA

H01J 27/00

361230, 165 96, 204600, 204450

Reversible flow may be provided in certain EHD device configurations that selectively energize corona discharge electrodes arranged to motivate flows in generally opposing directions. In some embodiments, a first set of one or more corona discharge electrodes is positioned, relative to a first array of collector electrode surfaces, to when energized, motivate flow in a first direction, while second set of one or more corona discharge electrodes is positioned, relative to a second array of collector electrode surfaces, to when energized, motivate flow in a second direction that opposes the first. In some embodiments, the first and second arrays of collector electrode surfaces are opposing surfaces of individual collector electrodes. In some embodiments, the first and second arrays of collector electrode surfaces are opposing surfaces of respective collector electrodes.

8411435, Apr 2, 2013

Nov 10, 2009

12/615900

Nels Jewell-Larsen - Campbell CA, US
Kenneth A. Honer - Santa Clara CA, US
Matt Schwiebert - San Jose CA, US
Hongyu Ran - Mountain View CA, US
Piyush Savalia - San Jose CA, US
Yan Zhang - San Jose CA, US

Tessera, Inc. - San Jose CA

F28D 15/00
H05K 7/20

361694, 36167947, 36167948, 36167949, 3616795, 361689, 361695, 361704, 165 803, 1651091, 165121, 417 49, 31511191

In thermal management systems that employ EHD devices to motivate flow of air between ventilated boundary portions of an enclosure, it can be desirable to have some heat transfer surfaces participate in electrohydrodynamic acceleration of fluid flow while providing additional heat transfer surfaces that may not. In some embodiments, both collector electrodes and additional heat transfer surfaces are thermally coupled into a heat transfer path. Collector electrodes then contribute both to flow of cooling air and to heat transfer to the air flow so motivated. The collector electrodes and additional heat transfer surfaces may be parts of a unitary, or thermally coupled, structure that is introduced into a flow path at multiple positions therealong. In some embodiments, the collector electrodes and additional heat transfer surfaces may be proximate each other along the flow path. In some embodiments, the collector electrodes and additional heat transfer surfaces may be separate structures.