Inventors:
Ying C. Hwang - Liverpool NY
Young K. Chen - Syracuse NY
Assignee:
General Electric Company - Syracuse NY
International Classification:
H01L 2980
H01L 2704
Abstract:
A novel signal scaling MESFET of a segmented dual gate design is disclosed. The MESFET, which is monolithically integrated on a semi-insulating substrate capable of localized surface modification to form active semiconductor regions using MMIC (monolithic microwave integrated circuit) techniques, has a small AC signal transfer which is adjustable in selected discrete steps. For operation in the gigahertz range, the substrate is preferably of gallium arsenide. In applying the MMIC technique, the MESFET, including segment electrodes and segment interconnections, and the electrical connections, signal paths, and passive components connected to the MESFET are formed on the substrate and defined by a photolithographic process. The technique permits reproducable feature definition and very compact minimum reactance segment interconnections, reducing deleterious parasitics and facilitating virtual unitary MESFET operation to very high frequencies. The signal scaling MESFET is an active MESFET subdivided into an n-fold plurality of selectively activated MESFET segments, each of a predetermined width, with dual gates for each segment.