Yu Y Chang, 521019 Brassington Dr, Collegeville, PA 19426

6423949, Jul 23, 2002

May 19, 1999

09/314845

Steven Aihua Chen - Fremont CA
Henry Ho - San Jose CA
Michael X. Yang - Fremont CA
Bruce W. Peuse - San Carlos CA
Karl Littau - Palo Alto CA
Yu Chang - San Jose CA

Applied Materials, Inc. - Santa Clara CA

H05B 368

2194441, 118725

A heating apparatus including a stage comprising a surface having an area to support a wafer and a body, a shaft coupled to the stage, and a first and a second heating element. The first heating element is disposed within a first plane of the body of the stage. The second heating element is disposed within a second plane of the body of the stage at a greater distance from the surface of the stage than the first heating element. A reactor comprising a chamber, a resistive heater, a first temperature sensor, and a second temperature sensor. A resistive heating system for a chemical vapor deposition apparatus comprising a resistive heater. A method of controlling the temperature in a reactor comprising providing a resistive heater in a chamber of a reactor, measuring the temperature with at least two temperature sensors, and controlling the temperature in the reactor by regulating a power supply to the first heating element and the second heating element according to the temperature measured by the first temperature sensor and the second temperature sensor.

6500263, Dec 31, 2002

Mar 26, 2001

09/817786

Yu Chang - San Jose CA
Wen Xiao Chen - Roseville CA

Applied Materials, Inc, - Santa Clara CA

C23C 16000

118715, 118707, 118733, 42725528

Multiple levels of interlocks are provided relative to gas flow for a chemical vapor deposition chamber. When a chamber lid used for normal processing is in place, no interlock is in effect. When a lid used during maintenance operations is in place, flow of toxic gas to the chamber is interlocked, but flow of purge gas is permitted. When no lid is in place, all gas flow to the chamber is interlocked. The interlock arrangement may be implemented with two switches, both of which are actuated when the lid for normal processing is in place, and only one of which is actuated by the lid for the maintenance process.

6618265, Sep 9, 2003

Oct 1, 2001

09/969202

Fong M. Chang - Los Gatos CA
Yu Chang - San Jose CA

Applied Materials, Inc. - Santa Clara CA

H05K 702

361760, 361775, 361823, 361828, 307 12, 307 29

All-or-none operation of a series of modular load elements is ensured by routing high and low voltage lines from a power source through opposite nodes positioned at either end of the series of load elements. This arrangement prevents activation of only a portion of the load elements where electrical connection between them is not successfully established.

6646235, Nov 11, 2003

Oct 19, 2001

10/037151

Steven Aihua Chen - Fremont CA
Henry Ho - San Jose CA
Michael X. Yang - Fremont CA
Bruce W. Peuse - San Carlos CA
Karl Littau - Palo Alto CA
Yu Chang - San Jose CA

Applied Materials, Inc. - Santa Clara CA

H05B 368

2194441, 118725

A heating apparatus including a stage comprising a surface having an area to support a wafer and a body, a shaft coupled to the stage, and a first and a second heating element. The first heating element is disposed within a first plane of the body of the stage. The second heating element is disposed within a second plane of the body of the stage at a greater distance from the surface of the stage than the first heating element. A reactor comprising a chamber, a resistive heater, a first temperature sensor, and a second temperature sensor. A resistive heating system for a chemical vapor deposition apparatus comprising a resistive heater. A method of controlling the temperature in a reactor comprising providing a resistive heater in a chamber of a reactor, measuring the temperature with at least two temperature sensors, and controlling the temperature in the reactor by regulating a power supply to the first heating element and the second heating element according to the temperature measured by the first temperature sensor and the second temperature sensor.

6734020, May 11, 2004

Mar 7, 2001

09/800881

Siqing Lu - San Jose CA
Yu Chang - San Jose CA
Dongxi Sun - Cupertino CA
Vinh Dang - San Jose CA
Michael X. Yang - Palo Alto CA
Anzhong Chang - San Jose CA
Anh N. Nguyen - Milpitas CA
Ming Xi - Milpitas CA

Applied Materials, Inc. - Santa Clara CA

G01N 3508

436 55

A valve control system for a semiconductor processing chamber includes a system control computer and a plurality of electrically controlled valves associated with the processing chamber. The system further includes a programmable logic controller in communication with the system control computer and operatively coupled to the electrically controlled valves. The refresh time for control of the valves may be less than 10 milliseconds. Consequently, valve control operations do not significantly extend the period of time required for highly repetitive cycling in atomic layer deposition processes. A hardware interlock may be implemented through the output power supply of the programmable logic controller.

7039083, May 2, 2006

Mar 12, 2003

10/387926

Chris H. Carroll - Santa Clara CA, US
Shiming Wang - Fremont CA, US
Yu Chung Chang - Cupertino CA, US
Joseph Indhiran Vanniasinkam - Toronto, CA

Opnext, Inc. - Fremont CA

H01S 3/04

372 36, 372 34

An optical assembly that can be utilized as a transmitter in a high data rate optical transceiver system is presented. The optical assembly allows a laser driver to be mounted near the laser and allows the laser driver and the laser to utilize a common heat sink. Further, assembly can be performed reliably and quickly to reduce the cost of production of the optical assembly.

7112961, Sep 26, 2006

Oct 14, 2003

10/685210

Lawrence C. Lei - Milpitas CA, US
Siqing Lu - San Jose CA, US
Yu Chang - San Jose CA, US
Cecilia Martner - Los Gatos CA, US
Quyen Pham - Sunnyvale CA, US
Yu Ping Gu - Sunnyvale CA, US
Joel Huston - San Jose CA, US
Paul Smith - Campbell CA, US
Gabriel Lorimer Miller - Eastham MA, US

Applied Materials, Inc. - Santa Clara CA

G01B 7/06
G01N 27/72

324230, 324226

A method and apparatus are provided for measuring the thickness of a test object. The apparatus includes an eddy current sensor having first and second sensor heads. The sensor heads are positioned to have a predetermined gap therebetween for passage by at least a portion of the test object through the gap. The sensor heads make measurements at given sampling locations on the test object as the test object is moved through the gap. The apparatus also includes a position sensing mechanism to determine positions of the sampling locations on the test object. The apparatus also includes an evaluation circuit in communication with the eddy current sensor and to the position sensing mechanism for determining the thickness of the test object at the sampling locations.

7201803, Apr 10, 2007

Dec 9, 2003

10/731651

Siqing Lu - San Jose CA, US
Yu Chang - San Jose CA, US
Dongxi Sun - Cupertino CA, US
Vinh Dang - San Jose CA, US
Michael X. Yang - Palo Alto CA, US
Anzhong (Andrew) Chang - San Jose CA, US
Anh N. Nguyen - Milpitas CA, US
Ming Xi - Milpitas CA, US

Applied Materials, Inc. - Santa Clara CA

B05C 11/00

118710

A valve control system for a semiconductor processing chamber includes a system control computer and a plurality of electrically controlled valves associated with the processing chamber. The system further includes a programmable logic controller in communication with the system control computer and operatively coupled to the electrically controlled valves. The refresh time for control of the valves may be less than 10 milliseconds. Consequently, valve control operations do not significantly extend the period of time required for highly repetitive cycling in atomic layer deposition processes. A hardware interlock may be implemented through the output power supply of the programmable logic controller.