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Yuan Li, 532302 University Ave, Madison, WI 53726

Related to:
Cindy Li 63

Yuan Li Phones & Addresses

2302 University Ave, Madison, WI 53726    608-2047103    608-2316982   

2302 University Ave APT 229, Madison, WI 53726    608-2047103   

14200 Lutheria Way, Saratoga, CA 95070    408-3408682   

Campbell, CA   

San Francisco, CA   

Work

Company: Allianz global corporate & specialty Aug 2014 Position: Senior financial analyst

Education

School / High School: Sonoma State University- Rohnert Park, CA Jul 2007 Specialities: BS in Accounting

Languages

English
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Mentions for Yuan Li

Career records & work history

Lawyers & Attorneys

Yuan Li Photo 1

Yuan Li - Lawyer

ISLN:
1000859236
Admitted:
2017

Medicine Doctors

Yuan Y. Li

Specialties:
Internal Medicine
Work:
Castle Health Medical Office PC
3916 Prince St APT 5A, Flushing, NY 11354
718-3586768 (phone) 718-3586783 (fax)
Education:
Medical School
Sun Yat Sen Univ of Med Sci, Guangzhou, China (242 21 Pr 1/71)
Graduated: 1987
Procedures:
Continuous EKG, Electrocardiogram (EKG or ECG), Hearing Evaluation, Pulmonary Function Tests, Vaccine Administration
Conditions:
Abnormal Vaginal Bleeding, Acne, Acute Upper Respiratory Tract Infections, Alopecia Areata, Bacterial Pneumonia, Bell's Palsy, Calculus of the Urinary System, Candidiasis, Cardiac Arrhythmia, Carpel Tunnel Syndrome, Cataract, Cholelethiasis or Cholecystitis, Conduction Disorders, Constipation, Disorders of Lipoid Metabolism, Gastritis and Duodenitis, Gastroesophageal Reflux Disease (GERD), Gingival and Periodontal Diseases, Gout, Hearing Loss, Hemolytic Anemia, Hemorrhoids, Herpes Zoster, Hyperthyroidism, Infectious Liver Disease, Inflammatory Bowel Disease (IBD), Intervertebral Disc Degeneration, Iron Deficiency Anemia, Irritable Bowel Syndrome (IBS), Malignant Neoplasm of Female Breast, Menopausal and Postmenopausal Disorders, Non-Toxic Goiter, Osteoporosis, Peptic Ulcer Disease, Peripheral Nerve Disorders, Plantar Warts, Psoriasis, Sciatica, Substance Abuse and/or Dependency, Thyroid Cancer, Thyroiditis, Tinea Pedis, Tinea Unguium, Urinary Incontinence, Uterine Leiomyoma, Varicose Veins, Vitamin D Deficiency, Abdominal Hernia, Acute Bronchitis, Acute Conjunctivitis, Acute Pharyngitis, Acute Renal Failure, Acute Sinusitis, Anal Fissure, Anemia, Ankylosing Spondylitis (AS), Anxiety Phobic Disorders, Atherosclerosis, Atrial Fibrillation and Atrial Flutter, Attention Deficit Disorder (ADD), Benign Thyroid Diseases, Bipolar Disorder, Breast Neoplasm, Malignant, Bronchial Asthma, Burns, Cardiomyopathy, Chronic Bronchitis, Chronic Pancreatitis, Chronic Renal Disease, Cirrhosis, Congenital Anomalies of the Heart, Contact Dermatitis, Dementia, Depressive Disorders, Diabetes Mellitus (DM), Diverticulitis, Diverticulosis, Emphysema, Endometriosis, Epilepsy, Erectile Dysfunction (ED), Esophagitis, Female Infertility, Follicular Cyst of the Ovary, Fractures, Dislocations, Derangement, and Sprains, Gastrointestinal Hemorrhage, Genital HPV, Glaucoma, Gonorrhea, Hallux Valgus, Heart Failure, Hemorrhagic stroke, Herpes Genitalis, Herpes Simplex, Hypertension (HTN), Hypothyroidism, Inguinal Hernia, Internal Derangement of Knee Cartilage, Ischemic Heart Disease, Lateral Epicondylitis, Lyme Disease, Male Infertility, Migraine Headache, Mitral Stenosis, Mitral Valvular Disease, Myasthenia Gravis (MG), Obstructive Sleep Apnea, Osteoarthritis, Otitis Media, Overweight and Obesity, Parkinson's Disease, Pelvic Inflammatory Disease (PID), Plantar Fascitis, Pneumonia, Polycystic Ovarian Syndrome (PCOS), Prostatitis, Pulmonary Tuberculosis (TB), Rheumatoid Arthritis, Rotator Cuff Syndrome and Allied Disorders, Schizophrenia, Scoliosis or Kyphoscoliosis, Sexually Transmitted Diseases (STDs), Skin and Subcutaneous Infections, Tempromandibular Joint Disorders (TMJ), Transient Cerebral Ischemia, Urinary Tract Infection (UT), Valvular Heart Disease, Ventral Hernia, Vitamin B12 Deficiency Anemia
Languages:
Chinese, English
Description:
Dr. Li graduated from the Sun Yat Sen Univ of Med Sci, Guangzhou, China (242 21 Pr 1/71) in 1987. She works in Flushing, NY and specializes in Internal Medicine. Dr. Li is affiliated with Flushing Hospital Medical Center and Queens Hospital Center.
Yuan Li Photo 2

Yuan Li, San Jose CA

Specialties:
Acupuncture
Address:
1153 Johnson Ave, San Jose, CA 95129
408-7252581 (Phone)
Languages:
English

Yuan Li resumes & CV records

Resumes

Yuan Li Photo 49

Yuan Li - San Rafael, CA

Work:
Allianz Global Corporate & Specialty Aug 2014 to 2000
Senior Financial Analyst Moss Adams LLP - San Francisco, CA Nov 2013 to Aug 2014
Auditor Wilson Markle Stuckey Hardesty & Bott, LLC - Larkspur, CA Jan 2008 to Dec 2012
Senior Auditor Maze & Associates, LLC - Pleasant Hill, CA Aug 2007 to Dec 2007
Auditor
Education:
Sonoma State University - Rohnert Park, CA Jul 2007
BS in Accounting

Publications & IP owners

Us Patents

Low Warpage Flip Chip Package Solution-Channel Heat Spreader

US Patent:
6888238, May 3, 2005
Filed:
Jul 9, 2003
Appl. No.:
10/616858
Inventors:
Yuan Li - Sunnyvale CA, US
Assignee:
Altera Corporation - San Jose CA
International Classification:
H01L023/34
US Classification:
257706
Abstract:
A semiconductor package includes a chip carrier to receive a semiconductor with a dimension generally greater than 22 mm. The chip carrier has a first coefficient of thermal expansion that is larger than the coefficient of thermal expansion of the semiconductor. A heat spreader having parallel channels on opposite sides is attached to the chip carrier along the channels. The heat spreader has a second coefficient of thermal expansion that is smaller than or equal to the coefficient of thermal expansion of the chip carrier. The interplay between the heat spreader and the chip carrier can effectively reduce package warpage and maintain coplanarity within the specification.

Structure And Material For Assembling A Low-K Si Die To Achieve A Low Warpage And Industrial Grade Reliability Flip Chip Package With Organic Substrate

US Patent:
6909176, Jun 21, 2005
Filed:
Nov 20, 2003
Appl. No.:
10/719451
Inventors:
Wen-Chou Vincent Wang - Cupertino CA, US
Donald S. Fritz - San Jose CA, US
Yuan Li - Sunnyvale CA, US
Assignee:
Altera Corporation - San Jose CA
International Classification:
H01L023/10
US Classification:
257706, 257701, 257783, 257775
Abstract:
Provided are a semiconductor low-K Si die flip chip package with warpage control and fabrication methods for such packages. The packages include heat spreaders that are attached to the low-K Si die and packaging substrate. In general, the modulus of the thermal interface material, which is used to attach the heat spreader to the low-K Si die, is selected as high as possible relative to other commercially available thermal interface materials. On the other hand, the modulus of the adhesive, which is used to attach the heat spreader via an optional stiffener to the substrate, is selected as low as possible relative to other commercially available adhesives. The result is a package with less bowing and so improved co-planarity (in compliance with industry specifications) with the surface to which it is ultimately bound. Moreover, the low-K Si die and package reliabilities are thereby enhanced.

Flip Chip Package With Warpage Control

US Patent:
6949404, Sep 27, 2005
Filed:
Nov 25, 2002
Appl. No.:
10/305671
Inventors:
Don Fritz - San Jose CA, US
Wen-chou Vincent Wang - Cupertino CA, US
Yuan Li - Sunnyvale CA, US
Assignee:
Altera Corporation - San Jose CA
International Classification:
H01L021/44
H01L021/48
H01L021/50
US Classification:
438106, 438107, 438108, 438125
Abstract:
Provided are a semiconductor flip chip package with warpage control and fabrication methods for such packages. The packages of the present invention include heat spreader lids that are rigidly attached to the die or packaging substrate with a bond that can withstand the considerable bowing pressures caused by the CTE mismatch between the die and substrate. The result is a package with less bowing and so improved co-planarity (in compliance with industry specifications) with the PCB board to which it is ultimately bound. Package reliability is thereby also enhanced, particularly for large die sizes.

Low Stress And Warpage Laminate Flip Chip Bga Package

US Patent:
7009307, Mar 7, 2006
Filed:
May 19, 2004
Appl. No.:
10/849651
Inventors:
Yuan Li - Sunnyvale CA, US
Assignee:
Altera Corporation - San Jose CA
International Classification:
H01L 23/48
H01L 23/52
H01L 29/40
US Classification:
257783, 257707, 438118
Abstract:
Provided are a semiconductor die flip chip package with warpage control and fabrication methods for such packages. The packages include heat spreaders that are attached to the die and packaging substrate. In general, the modulus of the adhesive, which is used to attach the heat spreader to the substrate, is selected to provide a relatively “soft” connection. The result is a package with less bowing and so improved co-planarity (e. g. , in compliance with industry specifications) with the surface to which it is ultimately bound. Moreover, the die and package reliabilities are thereby enhanced.

Structure And Material For Assembling A Low-K Si Die To Achieve A Low Warpage And Industrial Grade Reliability Flip Chip Package With Organic Substrate

US Patent:
7144756, Dec 5, 2006
Filed:
May 10, 2005
Appl. No.:
11/126571
Inventors:
Wen-Chou Vincent Wang - Cupertino CA, US
Donald S. Fritz - San Jose CA, US
Yuan Li - Sunnyvale CA, US
Assignee:
Altera Corporation - San Jose CA
International Classification:
H01I 21/44
US Classification:
438106, 257E23001
Abstract:
Provided are a semiconductor low-K Si die flip chip package with warpage control and fabrication methods for such packages. The packages include heat spreaders that are attached to the low-K Si die and packaging substrate. In general, the modulus of the thermal interface material, which is used to attach the heat spreader to the low-K Si die, is selected as high as possible relative to other commercially available thermal interface materials. On the other hand, the modulus of the adhesive, which is used to attach the heat spreader via an optional stiffener to the substrate, is selected as low as possible relative to other commercially available adhesives. The result is a package with less bowing and so improved co-planarity (in compliance with industry specifications) with the surface to which it is ultimately bound. Moreover, the low-K Si die and package reliabilities are thereby enhanced.

Low Warpage Flip Chip Package Solution-Channel Heat Spreader

US Patent:
7300822, Nov 27, 2007
Filed:
Apr 28, 2005
Appl. No.:
11/118630
Inventors:
Yuan Li - Sunnyvale CA, US
Assignee:
Altera Corporation - San Jose CA
International Classification:
H01L 21/00
US Classification:
438122, 257706
Abstract:
A semiconductor package includes a chip carrier to receive a semiconductor with a dimension generally greater than 22 mm. The chip carrier has a first coefficient of thermal expansion that is larger than the coefficient of thermal expansion of the semiconductor. A heat spreader having parallel channels on opposite sides is attached to the chip carrier along the channels. The heat spreader has a second coefficient of thermal expansion that is smaller than or equal to the coefficient of thermal expansion of the chip carrier. The interplay between the heat spreader and the chip carrier can effectively reduce package warpage and maintain coplanarity within the specification.

Structure, Material, And Design For Assembling A Low-K Si Die To Achieve An Industrial Grade Reliability Wire Bonding Package

US Patent:
7427813, Sep 23, 2008
Filed:
Nov 20, 2003
Appl. No.:
10/719218
Inventors:
Wen-chou Vincent Wang - Cupertino CA, US
Yuan Li - Sunnyvale CA, US
Assignee:
Altera Corporation - San Jose CA
International Classification:
H01L 29/40
H01L 23/28
H01L 23/29
US Classification:
257790, 257643, 257787, 257656, 257727, 257734
Abstract:
Provided are semiconductor low-K Si die wire bonding packages with package stress control and fabrication methods for such packages. The packages include molding interface material applied onto the low-K Si die. In general, the molding interface material is selectively applied onto the low-K Si die surface in order to minimize to safe levels the package stress experienced by the low-K Si die. Selective application includes defining various combinatorial patterns of coated and non-coated regions. In addition, selective application may also include a general application of molding interface material to create a stress buffer zone. The results are packages with less stress experienced by the low-K Si die and so improved reliability (in compliance with industry specifications).

Pad Structures To Improve Board-Level Reliability Of Solder-On-Pad Bga Structures

US Patent:
7446399, Nov 4, 2008
Filed:
Aug 4, 2004
Appl. No.:
10/911088
Inventors:
Yuan Li - Sunnyvale CA, US
Assignee:
Altera Corporation - San Jose CA
International Classification:
H01L 23/48
H01L 23/02
H01L 21/00
US Classification:
257669, 257674, 257784, 438119, 438646, 438612
Abstract:
The present invention is directed to a new bonding pad structure having a rugged contact interface that makes it more difficult for a crack to grow from the peripheral edge of the bonding pad. The rugged contact interface also helps to accumulate more solder paste on the edge of the bonding pad, increase the thickness of the solder layer near the pad edge and prevent the pad edge from being oxidized and turning into a crack initiation point.

Isbn (Books And Publications)

The Expressionist Landscape

Author:
Yuan Li
ISBN #:
0817438351

The Expressionist Landscape: A Master Photographer'S Approach

Author:
Yuan Li
ISBN #:
0817438343

Xin Wen Wu Bao Hu Fa Ji Shi Shi Tiao Li Wen Da

Author:
Yuan Li
ISBN #:
7801821947

Possible Relatives

David X Li  Daming Li  Deng Li  Daqi Li  Diane P Li  Dong M Li  Eberle M Li  Yuan M Kuo  Yuan M Ling  Yuan E Lo 

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