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Alexander M Veytser, 701429 Lloyd Way, Mountain View, CA 94040

Alexander Veytser Phones & Addresses

1429 Lloyd Way, Mountain View, CA 94040    650-2793647   

Santa Clara, CA   

20202 Pine Mountain Dr, Groveland, CA 95321   

Menlo Park, CA   

Palo Alto, CA   

1429 Lloyd Way, Mountain View, CA 94040   

Mentions for Alexander M Veytser

Publications & IP owners

Us Patents

Dielectric Covered Electrostatic Chuck

US Patent:
6414834, Jul 2, 2002
Filed:
Jun 16, 2000
Appl. No.:
09/596108
Inventors:
Edwin C. Weldon - Los Gatos CA
Kenneth S. Collins - San Jose CA
Arik Donde - Cupertino CA
Brian Lue - Mountain View CA
Dan Maydan - Los Altos Hills CA
Robert J. Steger - Cupertino CA
Timothy Dyer - Tempe AZ
Ananda H. Kumar - Milpitas CA
Alexander M. Veytser - Mountain View CA
Kadthala R. Narendrnath - San Jose CA
Semyon L. Kats - San Francisco CA
Arnold Kholodenko - San Francisco CA
Shamouil Shamouilian - San Jose CA
Dennis S. Grimard - Ann Arbor MI
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
H02N 1300
US Classification:
361234
Abstract:
An electrostatic chuck useful for holding a substrate in a high density plasma, comprises an electrode at least partially covered by a semiconducting dielectric , wherein the semiconducting dielectric may have an electrical resistance of from about 5Ã10 cm to about 8Ã10 cm.

Electrostatic Chuck Having Improved Electrical Connector And Method

US Patent:
6462928, Oct 8, 2002
Filed:
May 7, 1999
Appl. No.:
09/306944
Inventors:
Shamouil Shamouilian - San Jose CA
You Wang - Cupertino CA
Surinder S. Bedi - Fremont CA
Arnold Kholodenko - San Francisco CA
Alexander M. Veytser - Mountain View CA
Kadthala R. Narendrnath - San Francisco CA
Semyon L. Kats - San Francisco CA
Dennis S. Grimard - Ann Arbor MI
Wing L. Cheng - Sunnyvale CA
Ananda H. Kumar - Milpitas CA
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
H02N 1300
US Classification:
361234
Abstract:
An electrostatic chuck comprises an electrical connector which is connected to the electrode to conduct an electrical charge to the electrode The electrical connector comprises a refractory metal having a melting temperature of at least about 1500Â C. , such as for example, tungsten, titanium, nickel, tantalum, molybdenum, or alloys thereof. Preferably, the electrical connector is bonded to the electrode by a metal having a softening temperature of less than about 600Â C. , such as aluminum, indium, or low melting point alloys.

Plasma Chamber Support Having Dual Electrodes

US Patent:
6478924, Nov 12, 2002
Filed:
Mar 7, 2000
Appl. No.:
09/513992
Inventors:
Shamouil Shamouilian - San Jose CA
Arnold Kholodenko - San Francisco CA
Kwok Manus Wong - San Jose CA
Alexander M. Veytser - Mountain View CA
Dennis S. Grimard - Ann Arbor MI
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
H05H 100
US Classification:
15634548, 15634551, 118723 I, 118728, 361234, 279128
Abstract:
A process chamber capable of processing a substrate in a plasma comprises a dielectric covering a first electrode and a second electrode , a conductor supporting the dielectric , and a voltage supply to supply an RF voltage to the first electrode or the second electrode in the dielectric. The first electrode capacitively couples with a process electrode to energize process gas in the process chamber and RF voltage applied to the second electrode is capacitively coupled to the conductor and through a collar or the second electrode is directly capacitively coupled through the collar.

Electrostatic Chuck Bonded To Base With A Bond Layer And Method

US Patent:
6490146, Dec 3, 2002
Filed:
Aug 13, 2001
Appl. No.:
09/929806
Inventors:
You Wang - Cupertino CA
Shamouil Shamouilian - San Jose CA
Arnold Kholodenko - San Francisco CA
Alexander M. Veytser - Mountain View CA
Surinder S. Bedi - Fremont CA
Kadthala R. Narendrnath - San Jose CA
Semyon L. Kats - San Francisco CA
Dennis S. Grimard - Ann Arbor MI
Wing L. Cheng - Sunnyvale CA
Ananda H. Kumar - Milpitas CA
Assignee:
Applied Materials Inc. - Santa Clara CA
International Classification:
H01G 2300
US Classification:
361234, 361115, 361103
Abstract:
An electrostatic chuck for holding a substrate has an electrostatic member having a dielectric covering an electrode that is chargeable to electrostatically hold the substrate. The bond layer has a metal layer that is infiltrated or brazed between the electrostatic member and the base. The base may be a composite of a ceramic and metal, the composite having a coefficient of thermal expansion within about Â30% of a coefficient of thermal expansion of the electrostatic member. The base may also have a heater.

Plasma Chamber Support With Coupled Electrode

US Patent:
6494958, Dec 17, 2002
Filed:
Jun 29, 2000
Appl. No.:
09/607100
Inventors:
Shamouil Shamouilian - San Jose CA
Jon M. McChesney - San Ramon CA
Kwok Manus Wong - San Jose CA
Alexander M. Veytser - Mountain View CA
Dennis S. Grimard - Ann Arbor MI
Assignee:
Applied Materials Inc. - Santa Clara CA
International Classification:
C23C 1600
US Classification:
118728, 118723 E, 118723 I, 15634551, 15634548, 15634543
Abstract:
A process chamber capable of processing a substrate in a plasma of process gas. The chamber comprises a support having a dielectric covering an electrode and a conductor below the electrode. A voltage supply supplies a gas energizing voltage to the conductor , and the conductor is adapted to capacitively couple the voltage to the electrode to energize the process gas. Alternatively, the voltage may be supplied to the electrode through a connector which can capacitively couple with the conductor. A DC power supply may also provide an electrostatic chucking voltage to the electrode. In one version, the conductor comprises an interposer.

Substrate Support Having Bonded Sections And Method

US Patent:
6503368, Jan 7, 2003
Filed:
Jun 29, 2000
Appl. No.:
09/607533
Inventors:
Arnold Kholodenko - San Francisco CA
Vijay Parkhe - Sunnyvale CA
Shamouil Shamouilian - San Jose CA
You Wang - Cupertino CA
Wing L. Cheng - Sunnyvale CA
Alexander M. Veytser - Mountain View CA
Assignee:
Applied Materials Inc. - Santa Clara CA
International Classification:
C23C 1600
US Classification:
15634551, 15634552, 15634553, 15634548, 118728, 118500, 118723 I
Abstract:
A substrate support comprises first, second and third sections connected to one another by first and second bonds , one of the sections comprises a surface adapted to receive a substrate. The first bond comprises a first bonding material and the second bond comprises a second bonding material. In one version, the first bonding material is capable of bonding surfaces when heated to a first temperature and the second bonding material is capable of bonding surfaces when heated to a second temperature.

Electrostatic Chuck Having Heater And Method

US Patent:
6538872, Mar 25, 2003
Filed:
Nov 5, 2001
Appl. No.:
09/307214
Inventors:
You Wang - Cupertino CA
Shamouil Shamouilian - San Jose CA
Arnold Kholodenko - San Francisco CA
Alexander M. Veytser - Mountain View CA
Surinder S. Bedi - Fremont CA
Kadthala R. Narendrnath - San Jose CA
Semyon L. Kats - San Francisco CA
Dennis S. Grimard - Ann Arbor MI
Wing L. Cheng - Sunnyvale CA
Ananda H. Kumar - Milpitas CA
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
H01G 2300
US Classification:
361234, 361115, 361103
Abstract:
An electrostatic chuck for holding a substrate comprises an electrostatic member made from a dielectric covering an electrode that is chargeable to electrostatically hold the substrate A base that includes a heater is joined to the electrostatic member The base may be made from a composite material, such as a porous ceramic infiltrated with the metal, and may be joined to the electrostatic member by a bond layer.

Substrate Support Tolerant To Thermal Expansion Stresses

US Patent:
6583980, Jun 24, 2003
Filed:
Aug 18, 2000
Appl. No.:
09/641536
Inventors:
You Wang - Cupertino CA
Arnold Kholodenko - San Francisco CA
Shamouil Shamouilian - San Jose CA
Alexander M. Veytser - Mountain View CA
Wing L. Cheng - Sunnyvale CA
Assignee:
Applied Materials Inc. - Santa Clara CA
International Classification:
H01G 300
US Classification:
361234, 361233
Abstract:
A chamber for processing a substrate comprises a support including an electrode at least partially covered by a dielectric that is permeable to electromagnetic energy. The electrode may be chargeable to electrostatically hold the substrate , to couple energy to a gas in the chamber , or both. A base below the support comprises a slot that may be adapted to serve as a thermal expansion slot to reduce thermal stresses.

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