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David Dawei Wei, 6241560 Apricot Ln, Fremont, CA 94539

Known as:
David D Wei David Dawel Wei Dawei David Wei Dawei D Wei David Wei Dawei David Song Angie Wei Wei I Wei Dawei
Related to:
Hsiao Wei Chang 62

David Wei Phones & Addresses

41560 Apricot Ln, Fremont, CA 94539    510-2260896   

Tracy, CA   

Sunnyvale, CA   

San Joaquin, CA   

Alameda, CA   

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Mentions for David Dawei Wei

Career records & work history

Real Estate Brokers

David Wei Photo 1

David Wei

Specialties:
Buyer's Agent, Listing Agent
Work:
Comforhome
20380 Town Center Ln, #172, Cupertino, CA 95014
408-9813300 (Office)

Lawyers & Attorneys

David Wei Photo 2

David T Wei, Redwood City CA - Lawyer

Address:
Quinn Emanuel Urquhart Oliver & Hedges
555 Twin Dolphin Drive, Redwood City, CA 94065
Licenses:
California - Active 2004
Education:
Georgetown University Law CenterDegree JD - Juris Doctor - LawGraduated 2003
University of Michigan, Ann ArborDegree BS - Bachelor of Science - Biology, Political ScienceGraduated 1999
Specialties:
Litigation - 100%
Associations:
State Bar of California - Member
David Wei Photo 3

David Wei - Lawyer

Office:
Shay & Partners
Specialties:
Mergers and Acquisitions, Internet Law, Civil Litigation, Criminal Litigation, Administrative Law, Tax Law, Corporate Law, Securities, National Compensation Litigation
ISLN:
914291907
Admitted:
1998
Law School:
National Taiwan University, LL.B., 1993; National Taiwan University, LL.M., 1996
David Wei Photo 4

David Wei - Lawyer

Office:
Axcel LLP
Specialties:
UCL and Privacy, Alternative Dispute Resolution, Antitrust, Intellectual Property Law, Litigation
ISLN:
917569829
Admitted:
2004
University:
University of Michigan, Ann Arbor, B.S.; University of Michigan, Ann Arbor, B.S.
Law School:
Georgetown University, J.D., 2003

Medicine Doctors

David Wei Photo 5

Dr. David D Wei, Hayward CA - MD (Doctor of Medicine)

Specialties:
Anesthesiology
Address:
Kaiser Permanente Medical Ctr
27400 Hesperian Blvd, Hayward, CA 94545
510-7844000 (Phone)
Certifications:
Anesthesiology
Awards:
Healthgrades Honor Roll
Languages:
English
Chinese
Spanish
Vietnamese
Hospitals:
Alan S Wei MD
2240 Gladstone Dr Suite 1, Pittsburg, CA 94565
Sutter Delta Medical Center
3901 Lone Tree Way, Antioch, CA 94509
Kaiser Permanente Medical Ctr
27400 Hesperian Blvd, Hayward, CA 94545
Kaiser Permanente Hayward Medical Center
27400 Hesperian Boulevard, Hayward, CA 94545
Education:
Medical School
University Of Michigan Medical School
Graduated: 1997
Medical School
Stanford University Hospital
Graduated: 1997
David Wei Photo 6

Dr. David Wei, Pittsburg CA - MD (Doctor of Medicine)

Specialties:
Emergency Medicine
Address:
Alan S Wei MD
2240 Gladstone Dr Suite 1, Pittsburg, CA 94565
925-4391077 (Phone)
Languages:
English
Hospitals:
Alan S Wei MD
2240 Gladstone Dr Suite 1, Pittsburg, CA 94565
Sutter Delta Medical Center
3901 Lone Tree Way, Antioch, CA 94509
Education:
Medical School
Northwestern Center Feinberg School of Medicine
Graduated: 2007

David C. Wei

Specialties:
Urology
Work:
Urology Consultants
91-2139 Ft Weaver Rd STE 205, Ewa Beach, HI 96706
808-6776787 (phone) 808-5487799 (fax)
Education:
Medical School
University of Southern California Keck School of Medicine
Graduated: 1993
Procedures:
Kidney Stone Lithotripsy, Nephrectomy, Cystoscopy, Cystourethroscopy, Prostate Biopsy, Transurethral Resection of Prostate, Urinary Flow Tests
Conditions:
Calculus of the Urinary System, Benign Prostatic Hypertrophy, Bladder Cancer, Erectile Dysfunction (ED), Kidney Cancer, Prostate Cancer, Prostatitis, Testicular Cancer, Urinary Incontinence, Urinary Tract Infection (UT)
Languages:
Chinese, English, Tagalog
Description:
Dr. Wei graduated from the University of Southern California Keck School of Medicine in 1993. He works in Ewa Beach, HI and specializes in Urology. Dr. Wei is affiliated with Queens Medical Center.

David A. Wei

Specialties:
Emergency Medicine
Work:
Alan S Wei MD
2240 Gladstone Dr STE 1, Pittsburg, CA 94565
925-4391077 (phone) 925-9396282 (fax)
Education:
Medical School
Northwestern University Feinberg School of Medicine
Graduated: 2007
Languages:
English, Korean, Spanish
Description:
Dr. Wei graduated from the Northwestern University Feinberg School of Medicine in 2007. He works in Pittsburg, CA and specializes in Emergency Medicine. Dr. Wei is affiliated with Sutter Delta Medical Center.

David D. Wei

Specialties:
Anesthesiology
Work:
Kaiser Permanente Medical GroupKaiser Permanente San Leandro Medical Center
2500 Merced St FL 3, San Leandro, CA 94577
510-4544010 (phone) 510-4546947 (fax)
Site
Education:
Medical School
University of Michigan Medical School
Graduated: 1997
Languages:
English
Description:
Dr. Wei graduated from the University of Michigan Medical School in 1997. He works in San Leandro, CA and specializes in Anesthesiology. Dr. Wei is affiliated with Kaiser Permanente Medical Center - Roseville.
David Wei Photo 7

David Alexander Wei

Specialties:
Emergency Medicine
General Practice
Education:
Northwestern University (2007)
David Wei Photo 8

David Dazon Wei, Fremont CA

Specialties:
Anesthesiology
Work:
Kaiser Foundation Hospital - Fremont
39400 Paseo Padre Pkwy, Fremont, CA 94538
Education:
University of Michigan Medical School (1997)

David Wei resumes & CV records

Resumes

David Wei Photo 48

David Wei - San Jose, CA

Work:
Lattice Semiconductor 2011 to 2014
Design Engineer
Education:
De Anza College - Cupertino, CA 2014 to 2015
Taking Courses in Computer Science University of California Davis - Davis, CA 2007 to 2011
Bachelors in Electrical Engineering
Skills:
C++<br/>C<br/>Java<br/>Python<... Studio<br/>GCC<br/>GDB<br/>Ecl...
David Wei Photo 49

David Wei - Fremont, CA

Work:
RepairPal.com Mar 2012 to Present
Account/Project Manager Horn Audio - San Jose, CA Nov 2008 to Mar 2012
Account Manager
Education:
University of California - Los Angeles, CA 2008
Bachelor of Arts in History
Skills:
MS Suites

Publications & IP owners

Us Patents

Method And Apparatus For Reducing Compressed Dry Air Usage During Chemical Mechanical Planarization

US Patent:
6656024, Dec 2, 2003
Filed:
Dec 21, 2001
Appl. No.:
10/029742
Inventors:
John M. Boyd - Atascadero CA
David Wei - Fremont CA
Yehiel Gotkis - Fremont CA
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
B24B 500
US Classification:
451 41, 451 24, 451303, 451285
Abstract:
A retaining ring is provided. The retaining ring includes a lower annular sleeve having a base. The base has an inner sidewall and an outer sidewall extending therefrom. The lower annular sleeve has at least one hole defined therein. An upper annular sleeve is moveably disposed over the lower annular sleeve. The upper annular sleeve has a top, that has at least one hole defined therein. The top has an inner sidewall and an outer sidewall extending therefrom. A method for reducing a consumption of compressed dry air (CDA) during a chemical mechanical planarization (CMP) operation is also described.

Active Retaining Ring Support

US Patent:
6719874, Apr 13, 2004
Filed:
Mar 30, 2001
Appl. No.:
09/823800
Inventors:
Yehiel Gotkis - Fremont CA
Aleksander A. Owczarz - San Jose CA
Miguel A. Saldana - Fremont CA
David Wei - Fremont CA
Damon Vincent Williams - Fremont CA
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
B24B 100
US Classification:
15634514, 451 41
Abstract:
A chemical mechanical planarization (CMP) system having a polishing pad, a carrier body for holding a wafer, a retaining ring, and an active retaining ring support is provided. The active retaining ring is defined by a circular ring having a thickness and a width. The circular ring is defined by an elastomeric material. The circular ring is configured to be placed between the retaining ring and the carrier body. The circular ring has a plurality of voids therein, and the plurality of voids are defined in locations around the circular ring. The circular ring has a compressibility level that is set by the elastomeric material and the plurality of voids.

Cmp Belt Stretch Compensation Apparatus And Methods For Using The Same

US Patent:
6749491, Jun 15, 2004
Filed:
Dec 26, 2001
Appl. No.:
10/033501
Inventors:
Yehiel Gotkis - Fremont CA
David Wei - Fremont CA
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
B24B 2120
US Classification:
451296, 451311, 451499, 451 5
Abstract:
An apparatus for reducing non-uniform stretch of a belt used in the CMP system is disclosed. The belt that may be used with the apparatus extends between a first roller and a second roller to define a belt loop with an inner surface and an outer surface to be used for CMP. The apparatus includes a compensating roller that has a first end and a second end where the first end and second end extends a width of the belt. The first end and the second end have a first diameter. The center of the roller has a second diameter that is less than the first diameter. The compensating roller has a symmetrically tapered shape that extends between each of the first end and second end to the center. The compensating roller is positioned inside of the belt loop, and is applied to the inner surface of the belt loop to reduce non-uniform stretch of the belt.

Air Platen For Leading Edge And Trailing Edge Control

US Patent:
6761626, Jul 13, 2004
Filed:
Dec 20, 2001
Appl. No.:
10/037452
Inventors:
Anthony de la Llera - Union City CA
Xuyen Pham - Fremont CA
David Wei - Fremont CA
Tony Luong - San Jose CA
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
B24B 722
US Classification:
451303, 451307
Abstract:
An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt. At least one of the rings extends beyond an outer edge of a wafer to be planarized by the CMP belt. A support is attached with the platen and has a plurality of air ports for pressurized air to pass to the rings of the platen. A gasket is positioned between the support and the platen and has a plurality of cutouts that align with the openings and the air ports. A base is also included and supports the support.

Apparatus For Removal/Remaining Thickness Profile Manipulation

US Patent:
6808442, Oct 26, 2004
Filed:
Dec 20, 2001
Appl. No.:
10/027947
Inventors:
David Wei - Fremont CA
Yehiel Gotkis - Fremont CA
Aleksander Owczarz - San Jose CA
John M. Boyd - Atascadero CA
Rod Kistler - Los Gatos CA
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
B24B 100
US Classification:
451 59, 451 41, 451288, 451290, 451303, 451311, 451495
Abstract:
An invention is provided for removal rate profile manipulation during a CMP process. An apparatus of the embodiments of the present invention includes an actuator capable of vertical movement perpendicular to a polishing surface of a polishing pad. The actuator is further capable of flexing the polishing pad independently of a pad support device. Also included in the apparatus is an actuator control mechanism that is in communication with the actuator. The actuator control mechanism is capable of controlling an amount of vertical movement of the actuator, allowing the actuator to provide local flexing of the polishing pad to achieve a particular removal rate profile. The actuator can also be capable of horizontal movement parallel to the polishing surface of the polishing pad.

Cmp Belt Stretch Compensation Apparatus And Methods For Using The Same

US Patent:
6878048, Apr 12, 2005
Filed:
Jun 8, 2004
Appl. No.:
10/864031
Inventors:
Yehiel Gotkis - Fremont CA, US
David Wei - Fremont CA, US
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
B24B021/20
US Classification:
451296, 451 5, 451311, 451499
Abstract:
An apparatus for reducing non-uniform stretch of a belt used in the CMP system is disclosed. The belt that may be used with the apparatus extends between a first roller and a second roller to define a belt loop with an inner surface and an outer surface to be used for CMP. The apparatus includes a compensating roller that has a first end and a second end where the first end and second end extends a width of the belt. The first end and the second end have a first diameter. The center of the roller has a second diameter that is less than the first diameter. The compensating roller has a symmetrically tapered shape that extends between each of the first end and second end to the center. The compensating roller is positioned inside of the belt loop, and is applied to the inner surface of the belt loop to reduce non-uniform stretch of the belt.

Method And Apparatus For Heating Polishing Pad

US Patent:
6896586, May 24, 2005
Filed:
Mar 29, 2002
Appl. No.:
10/112628
Inventors:
Xuyen Pham - Fremont CA, US
Tuan Nguyen - San Jose CA, US
Ren Zhou - Fremont CA, US
David Wei - Fremont CA, US
Linda Jiang - Milpitas CA, US
Joseph P. Simon - Newark CA, US
Tony Luong - San Jose CA, US
Sridharan Srivatsan - Sunnyvale CA, US
Anjun Jerry Jin - Milpitas CA, US
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
B24B049/00
US Classification:
451 7, 451 8, 451 53
Abstract:
A temperature controlling system for use in a chemical mechanical planarization (CMP) system having a linear polishing belt, a carrier capable of applying a substrate over a preparation location over the linear polishing belt is provided. The temperature controlling system includes a platen having a plurality of zones. The temperature controlling system further includes a temperature sensor configured determine a temperature of the linear polishing belt at a location that is after the preparation location. The system also includes a controller for adjusting a flow of temperature conditioned fluid to selected zones of the plurality of zones of the platen in response to output received from the temperature sensor.

Apparatus For Reducing Compressed Dry Air Usage During Chemical Mechanical Planarization

US Patent:
6976906, Dec 20, 2005
Filed:
Oct 7, 2003
Appl. No.:
10/681719
Inventors:
John M. Boyd - Atascadero CA, US
David Wei - Fremont CA, US
Yehiel Gotkis - Fremont CA, US
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
B24B005/00
US Classification:
451 41, 451 24, 451285, 451303
Abstract:
A chemical mechanical planarization (CMP) system is provided. The system includes a polishing surface and a platen disposed along an underside of the polishing surface. A retaining ring surrounds the platen. The retaining ring includes a lower annular sleeve and an upper annular sleeve moveably disposed over the lower annular sleeve. A method for reducing a consumption of compressed dry air (CDA) during a chemical mechanical planarization (CMP) operation is also described.

Public records

Vehicle Records

David Wei

Address:
4142 Stevenson Blvd APT 1216, Fremont, CA 94538
Phone:
510-6978898
VIN:
WMWMF73547TT83205
Make:
MINI
Model:
COOPER
Year:
2007

Possible Relatives

Dawei D Wei  Dan Wei  Daniel K Wei  Dao C Wei  Dongsheng Wei  Eddie Y Wei  Ellen Y Wei  David Last  David W Johnson  David Stamps 

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