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Daxesh Patel, 39Gaithersburg, MD

Known as:
Daxeshkumar B Patel H Pabel
Related to:
Amrutbhai P Patel 69

Daxesh Patel Phones & Addresses

Gaithersburg, MD   

Bethesda, MD   

Levittown, PA   

Pottstown, PA   

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Resumes & CV records

Resumes

Daxesh Patel Photo 29

Daxesh Patel

Location:
United States
Daxesh Patel Photo 30

Database Administrator

Location:
Washington D.C. Metro Area
Industry:
Information Technology and Services
Daxesh Patel Photo 31

Daxesh Patel

Location:
United States
Daxesh Patel Photo 32

Daxesh Patel

Location:
United States

Publications & IP owners

Us Patents

Method For Providing Overnight Accommodations

US Patent:
2009011, Apr 30, 2009
Filed:
Oct 30, 2007
Appl. No.:
11/978833
Inventors:
Daxesh Patel - Somerset NJ, US
Ashish Patel - Somerset NJ, US
International Classification:
G06Q 10/00
G06Q 30/00
US Classification:
705 5, 705 14
Abstract:
A method of renting out one or more rooms by a Provider is disclosed. The Provider acquires a block of one or more rooms from an overnight accommodations operator for a long term basis. The Provider then sets a price for a room in a geographic area at a consistent price. The Provider then rents the room to a Customer, wherein the proceeds from the room rental are payable to the Provider.

Method For Providing Overnight Accommodations

US Patent:
2009011, Apr 30, 2009
Filed:
Oct 29, 2008
Appl. No.:
12/260126
Inventors:
Daxesh Patel - Somerset NJ, US
Ashish Patel - Somerset NJ, US
International Classification:
G06Q 30/00
G06Q 10/00
G06Q 50/00
US Classification:
705 5, 705 28
Abstract:
A method of renting out one or more rooms by a Provider is disclosed. The Provider acquires a block of one or more rooms from one or more overnight accommodations operator for a long term basis and enters information on the rooms into a computer database. The Provider then sets a price for a room in a geographic area at a consistent price. Upon the request of a potential Customer, the Provider searches the database for room availability and rents the room to a Customer, wherein the proceeds from the room rental are payable to the Provider.

Intermediate Product For Use In The Production Of Thick-Film Circuits

US Patent:
5206624, Apr 27, 1993
Filed:
Feb 27, 1992
Appl. No.:
7/842693
Inventors:
Daxesh K. Patel - Hatfield PA
Jay D. Baker - Detroit MI
Assignee:
Ford Motor Company - Dearborn MI
International Classification:
H01C 1012
US Classification:
338308
Abstract:
An intermediate product is provided and includes a substrate having at least one thick-film circuit formed thereon. An outer surface of a first portion of the thick-film circuit is coated with a readily removable protective material such as ethyl cellulose to protect the first portion from hot-slag substrate material generated during a laser scribing operation. The substrate also includes at least one uncoated portion which can be laser scribed for separation of the thick-film circuit from the remainder of the substrate. After laster scribing, the protective material is removed to permit visual inspection of the thick-film circuit.

Method For Laser Scribing Substrates

US Patent:
5116641, May 26, 1992
Filed:
Aug 20, 1990
Appl. No.:
7/570063
Inventors:
Daxesh K. Patel - Hatfield PA
Jay D. Baker - Detroit MI
Assignee:
Ford Motor Company - Dearborn MI
International Classification:
C23C 2600
US Classification:
427 96
Abstract:
A method is provided for forming a thick-film circuit having at least one thick-film resistor element upon a substrate and laser scribing the substrate to remove the circuit from the remaining portion of the substrate. A thick-film circuit comprising conductor lines and at least one resistor element is first printed upon a substrate. Thereafter, the resistor element may be laser trimmed to increase the resistance value thereof. After laser trimming, a protective material such as ethyl cellulose is coated onto the outer surface of the resistor element to protect it from hot-slag ceramic material generated during a laser scribing operation. The substrate is then topside laser scribed to separate the thick-film circuit from the remaining portion of the substrate. Following laser scribing, the protective material is removed by washing the resistor element with a solvent.

Possible Relatives

David Patel  Dawood M Patel  Daxa R Patel  Daxaben C Patel  Daxeshkumar B Patel  Dayalji D Patel  Dahyabhai Patel 

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