Debashis K Ghosh, 735362 Waterlefe Dr, Clarence, NY 14031

6695039, Feb 24, 2004

Feb 25, 2003

10/374349

Ilya Reyzin - Williamsville NY
Mohinder Singh Bhatti - Amherst NY
Shrikant Mukund Joshi - Williamsville NY
Debashis Ghosh - Amherst NY

Delphi Technologies, Inc. - Troy MI

F28D 1500

16510421, 16510433, 361700, 257715, 174 152

A thermosiphon assembly for dissipating heat generated by an electronic component using a working fluid is disclosed. The assembly includes an evaporator having a front face, a rear face, and a peripheral wall extending between the front face and the rear face and being arcuate. A heat block contacts the front face for transferring generated heat from the electronic component to the working fluid to vaporize the working fluid. A condenser is in fluid communication with the chamber and connected to the rear face for condensing the vaporized working fluid back to a liquid. The assembly further includes an acute angle between the front face and the peripheral wall such that the chamber extends upwardly at an angle from the front face to the rear face to ensure complete coverage of the heat block with the cooling fluid in any position between horizontal and vertical.

6714413, Mar 30, 2004

Oct 15, 2002

10/271630

Debashis Ghosh - Amherst NY
Mohinder Singh Bhatti - Amherst NY
Ilya Reyzin - Williamsville NY

Delphi Technologies, Inc. - Troy MI

H05K 720

361700, 174 152, 257716, 16510433, 16510421, 361698, 361699

A heat sink assembly for cooling an electronic device comprises a fan housed in a shroud, the fan including a hub and fan blades extending therefrom for causing an axially directed airflow through the shroud upon rotation of the fan blades. A thermosiphon comprises an evaporator defining an evaporating chamber containing a working fluid therein and further including a condenser mounted thereabove. The thermosiphon is positioned at one end of the shroud such that the fan is aligned with the condenser for directing the axial airflow therethrough. The condenser includes a base having an upper surface and a plurality of fins extending substantially upwardly from the upper surface. The condenser also includes a plurality of tubes forming a tube grouping. Each tube having an opening in fluid communication with the evaporator and for receiving and condensing vapor of the working fluid received from the evaporator. The tubes are axially aligned with the airflow and are laterally positioned such that a lateral width of the tube grouping is approximately equal to a width of the hub and substantially in lateral alignment therewith.

6834713, Dec 28, 2004

Jul 18, 2002

10/198322

Debashis Ghosh - Amherst NY
Shrikant Mukund Joshi - Williamsville NY
Ilya Reyzin - Williamsville NY
Mohinder Singh Bhatti - Amherst NY

Delphi Technologies, Inc. - Troy MI

F28D 1500

16510433, 16510421, 174 152, 257715, 361700

A heat sink assembly for cooling an electronic device comprises a fan housed in a shroud, the fan including a hub and fan blades extending therefrom for causing an axially directed airflow through the shroud upon rotation of the fan blades. A thermosiphon comprises an evaporator defining an evaporating chamber containing a working fluid therein and further including a condenser mounted thereabove. The thermosiphon is positioned at one end of the shroud such that the fan is aligned with the condenser for directing the axial airflow therethrough. The condenser includes a plurality of tubes forming a tube grouping. Each tube having an opening in fluid communication with the evaporator and for receiving and condensing vapor of the working fluid received from the evaporator. The tubes are axially aligned with the airflow and are laterally positioned such that a lateral width of the tube grouping is approximately equal to a width of the hub and substantially in lateral alignment therewith.

6840311, Jan 11, 2005

Feb 25, 2003

10/374346

Debashis Ghosh - Amherst NY, US
Mohinder Singh Bhatti - Amherst NY, US
Ilya Reyzin - Williamsville NY, US

Delphi Technologies, Inc. - Troy MI

H05K 720

16510433, 361700

A compact thermosiphon assembly for dissipating heat generated by electronic components using a working fluid includes a tube having a first end and a second end and a flat cross section defining an elongated chamber is disclosed. The tube has an evaporation region for receiving heat to evaporate the working fluid into a vaporized working fluid within the chamber disposed between a first condensation region and a second condensation region opposite the first condensation region for condensing the vaporized working fluid back into a liquefied working fluid within the chamber. Each of the condensation regions have a first portion extending upwardly at a first angle from the evaporation region and a second portion extending upwardly at a second angle different than the first angle.

6918431, Jul 19, 2005

Aug 22, 2003

10/646505

Ilya Reyzin - Williamsville NY, US
Mohinder Singh Bhatti - Amherst NY, US
Debashis Ghosh - Amherst NY, US

Delphi Technologies, Inc. - Troy MI

H05K007/20

16510421, 16510433, 361700

A cooling assembly having a base plate and a condenser plate. An outer wall interconnects the base plate to the condenser plate to define a sealed chamber with a working fluid being disposed within the sealed chamber. Intersecting partition walls are mounted to the condenser plate and are angled downwardly toward the base plate for directing working fluid on the condenser plate down a corner of the walls toward a portion of the base plate. Preferably, the base plate defines a first circumference and the condenser plate defines a second circumference larger than the first circumference such that the outer wall has an angled configuration extending between the base plate and the condenser plate to provide a larger area within the sealed chamber for a vapor phase of the working fluid than a liquid phase of the working fluid.

7119434, Oct 10, 2006

Jul 5, 2005

11/174903

Debashis Ghosh - Amherst NY, US
Mohinder Singh Bhatti - Amherst NY, US
Ilya Reyzin - Williamsville NY, US

Delphi Technologies, Inc. - Troy MI

H01L 23/10

257707, 257706, 257720, 257E23101, 257E2311

A CPU cooling assembly having a first, covering layer of conductive material above the upper surface of an enclosed, heat producing chip and a third, upper layer of conductive material (a heat sink base plate) thermally bonded to the first by an intermediate, second layer of thin, conforming material (thermal grease) that is far less thermally conductive, and more resistive, than the other two layers. The relative thickness relationship of the first and third, more conductive, layers is essentially reversed from the prior art, with first layer being relatively thicker than the third. This creates an overall lower resistance for the three layer sandwich.

7143816, Dec 5, 2006

Sep 9, 2005

11/223544

Debashis Ghosh - Amherst NY, US
Mohinder Singh Bhatti - Amherst NY, US
Ilya Reyzin - Williamsville NY, US
Mark Joseph Parisi - East Amherst NY, US

Delphi Technologies, Inc. - Troy MI

H05K 7/20

165 804, 361699, 16510428, 16510433

A heat sink for an electrical device is distinguished by a confining plate extending parallel to and along each lateral side of fins and extending upwardly from a top surface of a base to a bottom surface of a lid to define an outlet-chamber extending from the outer ends of the fins and outside of the fins back toward a vertical nozzle. A cylindrical outlet is disposed on the inlet axis outwardly of each of the confining plates for directing fluid flow on each side of the fins. The outer wall presents a pair of oppositely facing apexes and the outer wall curves outwardly from each apex in opposite directions in a generally heart-shape around and spaced from the fins and back into the outlets to define the outlet-chambers which increase in volume from the ends of the fins back toward the outlets to reduce the fluid pressure. In an alternative embodiment, a horizontal nozzle is disposed between each of the outlets and the vertical nozzle for directing fluid flow horizontally into the fluid flow emitted from the vertical nozzle.

7331380, Feb 19, 2008

Aug 17, 2005

11/205338

Debashis Ghosh - Amherst NY, US
Mohinder Singh Bhatti - Amherst NY, US
Ilya Reyzin - Williamsville NY, US
Mark Joseph Parisi - East Amherst NY, US

Delphi Technologies, Inc. - Troy MI

F28F 13/06

16510433, 165125

A heat sink removes heat from an electronic device and comprises a base, a lid. An inner ring of first fins extend radially outwardly first length from an inner circle and extend axially a first height from the top surface of the base, and an outer ring of second fins extend radially inwardly a second length from an outer periphery and extend axially a second height from the top surface of the base. A confining plate extends radially above the fins and is spaced below the bottom surface of the lid whereby coolant fluid flows from an inlet opening of the lid through the center opening of the confining plate and radially outwardly through the fins and upward around the outer edge of the confining plate and into the space above the confining plate to an outlet opening. A nozzle having a throat is disposed above the lid and extends below the lid to the confining plate. A flow diverter extends upwardly from the top surface of the base and into and through the throat of the nozzle.