BackgroundCheck.run
Search For

Edmond Cheng, 492221 Clover Ridge Dr, Cedar Park, TX 78613

Known as:
Cheng Mayer R Cheng Tezirae Crittenden
Related to:
Angela C Chen 53 Jong Juh Chen 86 Liming Lewis 59 Felix Friedberg 98

Edmond Cheng Phones & Addresses

2221 Clover Ridge Dr, Cedar Park, TX 78613    512-2500213    512-3353961   

11506 Chancellroy Dr, Austin, TX 78759    512-2500213   

Niagara Falls, NY   

Get Report
Control this profile

Mentions for Edmond Cheng

Edmond Cheng resumes & CV records

Resumes

Edmond Cheng Photo 30

Test Manager, Mad Derivatives, Mts At Freescale Semiconductor

Position:
Test Manager, MAD Derivatives, MTS at Freescale Semiconductor
Location:
Austin, Texas Area
Industry:
Semiconductors
Work:
Freescale Semiconductor since May 2012
Test Manager, MAD Derivatives, MTS Freescale Semiconductor 2008 - Apr 2012
Test Engineering Lead, MTS Freescale Semiconductor. 2006 - 2008
Senior Test Engineer Motorola Inc. Jun 1994 - Dec 2005
Product/Test Engineer
Education:
The University of Texas at Austin 1993 - 1997
Bachelor of Science, Electrical Engineering
Edmond Cheng Photo 31

Edmond Cheng

Location:
United States

Publications & IP owners

Us Patents

Method And Apparatus For Testing A Semiconductor Structure Having Top-Side And Bottom-Side Connections

US Patent:
2007009, May 3, 2007
Filed:
Oct 31, 2005
Appl. No.:
11/263089
Inventors:
Edmond Cheng - Cedar Park TX, US
Addi Mistry - Austin TX, US
David Patten - Austin TX, US
International Classification:
G01R 31/26
US Classification:
324765000
Abstract:
A method for testing a semiconductor structure having a set of top-side connections and having a set of bottom-side connections is provided. The method may include providing a device socket for connecting the set of top-side connections and the set of bottom-side connections to a tester. The method may further include providing a device hood for connecting the set of top-side connections to a respective first end of each of a plurality of interconnects in the device hood, wherein a second end of each of the plurality of interconnects in the device hood connects the set of top-side connections to the device socket. The method may further include testing the semiconductor structure using the tester. The semiconductor structure may include at least one integrated circuit to be tested.

Possible Relatives

Cynthia C Cheng  David Cheng  Dai P Cheng  Daisy Cheng  Deborah H Cheng  Debra L Cheng  Aaron Cheng  Edmond Johnson  Edmond D Johnston  Edmond D White 

NOTICE: You may not use BackgroundCheck or the information it provides to make decisions about employment, credit, housing or any other purpose that would require Fair Credit Reporting Act (FCRA) compliance. BackgroundCheck is not a Consumer Reporting Agency (CRA) as defined by the FCRA and does not provide consumer reports.