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Erik W Walles, 694744 Bryan Station Rd, Lexington, KY 40516

Known as:
Erik Tonkinsonwalles Gayle Walles Eric W Walles Erik Tompkinson Allese Allen
Related to:
Brett Walles

Erik Walles Phones & Addresses

4744 Bryan Station Rd, Lexington, KY 40516    859-2930077   

4148 Foxtail Trl, Copley, OH 44321    330-6660011    330-6660109   

Lanesborough, MA   

Tavernier, FL   

Rensselaer, NY   

Saint Louis, MO   

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Us Patents

Microencapsulation Method, Microelectronic Devices Made Therefrom, And Heat Curable Compositions

US Patent:
5095053, Mar 10, 1992
Filed:
Jan 14, 1991
Appl. No.:
7/640678
Inventors:
Erik W. Walles - Rensselaer NY
James V. Crivello - Clifton Park NY
John H. Lupinski - Scotia NY
Assignee:
General Electric Company - Schenectady NY
International Classification:
C08G 5944
US Classification:
523466
Abstract:
A method for encapsulating microelectronic devices is provided using a heat curable epoxy composition having a monomeric or polymeric diaryliodonium hexafluoroantimonate salt. Curable compositions are also provided as well as encapsulated microelectronic devices.

Fibers Impregnated With Epoxy Resin Mixture, Brominated Bisphenol And Polyphenylene Ether

US Patent:
5096771, Mar 17, 1992
Filed:
Aug 10, 1990
Appl. No.:
7/565082
Inventors:
Erik W. Walles - Rensselaer NY
John H. Lupinski - Scotia NY
Mark Markovitz - Schenectady NY
Robert E. Colborn - Schenectady NY
James R. Presley - Schenectady NY
Michael J. Davis - Coshocton OH
Michael G. Minnick - Coshocton OH
Steven J. Kubisen - Coshocton OH
John E. Hallgren - Scotia NY
Donald A. Bolon - Scotia NY
Victoria J. Eddy - Schenectady NY
Patricia C. Irwin - Schenectady NY
Assignee:
General Electric Company - Schenectady NY
International Classification:
B32B 2700
B32B 1508
B32B 1704
B32B 2704
US Classification:
428290
Abstract:
Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.

Encapsulation Method, Microelectronic Devices Made Therefrom, And Heat Curable Compositions Based On Epoxy Resins, Diaryliodonium Hexafluroantimonate Salts And Free Radical Generators

US Patent:
5015675, May 14, 1991
Filed:
Jul 31, 1989
Appl. No.:
7/386670
Inventors:
Erik W. Walles - Rensselaer NY
John H. Lupinski - Scotia NY
James V. Crivello - Clifton Park NY
Assignee:
General Electric Company - Schenectady NY
International Classification:
C08G 5968
C08G 810
C08F 400
C08F 406
US Classification:
523443
Abstract:
A heat curable composition is provided which is useful for encapsulating microelectronic devices using a heat curable epoxy composition having a diaryliodonium hexafluoroantimonate salt as a catalyst in combination with an effective amount of a free radical generating aromatic compound as a cocatalyst.

Curable Polyphenylene Ether-Polyepoxide Compositions Useful In Printed Circuit Board Production

US Patent:
4853423, Aug 1, 1989
Filed:
Jul 14, 1988
Appl. No.:
7/219106
Inventors:
Erik W. Walles - Rensselaer NY
John H. Lupinski - Scotia NY
Mark Markovitz - Schenectady NY
Robert E. Colborn - Schenectady NY
James R. Presley - Schenectady NY
Michael J. Davis - Coshocton OH
Michael G. Minnick - Coshocton OH
Steven J. Kubisen - Coshocton OH
John E. Hallgren - Scotia NY
Donald A. Bolon - Scotia NY
Victoria J. Eddy - Schenectady NY
Patricia C. Irwin - Schenectady NY
Assignee:
General Electric Company - Schenectady NY
International Classification:
C08L 6110
C08L 6302
C08L 6304
C08L 7104
US Classification:
523428
Abstract:
Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.

Method Of Encapsulating Electronic Devices

US Patent:
4842800, Jun 27, 1989
Filed:
Oct 1, 1987
Appl. No.:
7/103153
Inventors:
Erik W. Walles - Rensselaer NY
James V. Crivello - Clifton Park NY
John H. Lupinski - Scotia NY
Assignee:
General Electric Company - Schenectady NY
International Classification:
B29C 4514
US Classification:
26427213
Abstract:
A method for encapsulating microelectronic devices is provided using a heat curable epoxy composition having a monomeric or polymeric diaryliodonium hexafluoroantimonate salt. Curable compositions are also provided as well as encapsulated microelectronic devices.

Polyphenylene Ether-Polyarylene Sulfide Compositions

US Patent:
5122578, Jun 16, 1992
Filed:
Apr 19, 1990
Appl. No.:
7/511121
Inventors:
Choong Y. Han - Pittsfield MA
Sterling B. Brown - Schenectady NY
Erik W. Walles - Rensselaer NY
Tohru Takekoshi - Scotia NY
Andrew J. Caruso - Schenectady NY
Assignee:
General Electric Company - Schenectady NY
International Classification:
C08G 7502
C08L 8104
US Classification:
525537
Abstract:
Compatible compositions comprising polyarylene sulfide-polyphenylene ether copolymers are prepared by the reaction of a polyphenylene ether containing epoxy groups, typically an epoxytriazine-capped polyphenylene ether, with a polyarylene sulfide containing epoxide-reactive functional groups, preferably amine groups. It is sometimes advantageous to anneal said compositions or molded articles prepared therefrom.

Printed Circuit Board From Fibers Impregnated With Epoxy Resin Mixture, Halogenated Bisphenol And Polyphenylene Ether

US Patent:
4975319, Dec 4, 1990
Filed:
Apr 3, 1989
Appl. No.:
7/332070
Inventors:
Erik W. Walles - Rensselaer NY
John H. Lupinski - Scotia NY
Mark Markovitz - Schenectady NY
Robert E. Colborn - Schenectady NY
James R. Presley - Schenectady NY
Michael J. Davis - Coshocton OH
Michael G. Minnick - Coshocton OH
Steven J. Kubisen - Coshocton OH
John E. Hallgren - Scotia NY
Donald A. Bolon - Scotia NY
Victoria J. Eddy - Schenectady NY
Patricia C. Irwin - Schenectady NY
Assignee:
General Electric Company - Schenectady NY
International Classification:
B32B 2700
B32B 1508
B32B 1704
B32B 2704
US Classification:
428265
Abstract:
Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.

Encapsulation Method, Microelectronic Devices Made Therefrom, And Heat Curable Compositions Based On Epoxy Resins, Diarliodonium-Hexafluoroantimonate Salts And Free Radical Generators

US Patent:
5064882, Nov 12, 1991
Filed:
Jan 25, 1991
Appl. No.:
7/645778
Inventors:
Erik W. Walles - Rensselaer NY
John H. Lupinski - Scotia NY
James V. Crivello - Clifton Park NY
Assignee:
General Electric Company - Schenectady NY
International Classification:
H01L 2328
US Classification:
523443
Abstract:
A heat curable composition is provided which is useful for encapsulating microelectronic devices using a heat curable epoxy composition having a diaryliodonium hexafluoroantimonate salt as a catalyst in combination with an effective amount of a free radical generating aromatic compound as a cocatalyst.

Isbn (Books And Publications)

Jonas Walles, Teologen Som Gick Sin Egen Vag: En Biografi

Author:
Erik Walles
ISBN #:
9171183825

Possible Relatives

Dean A Walles  Danielle F Walles  John R Walles  Patty L Walles  Erik P Johnson  Erik B Stanford  Erik K White  Erik V Jones  Erik G Stanley  Erik R Stanton 

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