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Joseph L Perault Deceased185 Hudson St, Somerville, MA 02144

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185 Hudson St, Somerville, MA 02144    617-6662454   

Las Vegas, NV   

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Joseph H Perault

Address:
Somerville, MA 02144
Licenses:
License #: 16368 - Expired
Expiration Date: May 1, 1994
Type: Journeyman Plumber

Publications & IP owners

Us Patents

Methods And Apparatus For Cleaning A Stencil

US Patent:
6955121, Oct 18, 2005
Filed:
Feb 20, 2004
Appl. No.:
10/784123
Inventors:
Joseph A. Perault - Natick MA, US
William Russell Claiborne - Worcester MA, US
Assignee:
Speedline Technologies, Inc. - Franklin MA
International Classification:
B41M001/12
B41F035/00
A46B015/00
US Classification:
101129, 101424, 101425, 101483, 1525651, 1525652
Abstract:
A stencil wiper apparatus for wiping a stencil of a stencil printer includes a material supply assembly having a supply roller to deliver a roll of material, a take-up roller to receive the material, and a drive to move the material across the stencil between the supply roller and the take-up roller. The apparatus further includes a fluid delivery assembly to wet the material. The fluid delivery assembly includes an outer tube, an inner tube and a fluid delivery source. The outer tube is designed to engage the material and to deliver fluid to the material. The inner tube is positioned within the outer tube, and designed to deliver fluid to the outer tube. The fluid delivery source delivers fluid to the inner tube. A method for wiping a stencil of a printing machine is further disclosed.

Methods And Apparatus For Changing Web Material In A Stencil Printer

US Patent:
7017489, Mar 28, 2006
Filed:
Feb 20, 2004
Appl. No.:
10/784122
Inventors:
Joseph A. Perault - Natick MA, US
Randy L. Peckham - North Scituate RI, US
Gary T. Freeman - Attleboro MA, US
Assignee:
Speedline Technologies, Inc. - Franklin MA
International Classification:
B41F 35/00
US Classification:
101425, 101129, 101423, 400692, 151035
Abstract:
A quick-change material module of a stencil wiper assembly for wiping a stencil of a stencil printer includes a supply roller to receive a roll of material, a take-up roller to receive used material, and a drive to move the material across the stencil between the supply roller and the take-up roller. The supply roller is designed to move between an operating position in which the module functions to wipe the stencil and a changing position in which the supply roller is accessible to change the roll of material. A pivot mechanism is further disclosed for pivoting the supply roller between the operating and changing positions. A frame supports the supply roller, the take-up roller, and the drive. The pivot mechanism includes at least one pivot arm having one end rotatably attached to the supply roller and an opposite end pivotably attached to the frame. A method for changing a roll of material within a quick-change material module of a stencil wiper assembly designed to wipe a stencil of a stencil printer is further disclosed.

Self-Contained Vacuum Module For Stencil Wiper Assembly

US Patent:
7040228, May 9, 2006
Filed:
Feb 20, 2004
Appl. No.:
10/784121
Inventors:
Joseph A. Perault - Natick MA, US
William Russell Claiborne - Worcester MA, US
Assignee:
Speedline Technologies, Inc. - Franklin MA
International Classification:
B41F 35/00
B41L 41/00
US Classification:
101424, 101423, 101425, 15 21
Abstract:
A vacuum plenum module of a stencil wiper assembly for wiping and removing excess material from a stencil of a stencil printer includes a wiper blade to wipe the stencil, a plenum chamber in fluid communication with the wiper blade, and a vacuum generator attached to and in fluid communication with the plenum chamber to create a vacuum within the plenum chamber. The vacuum plenum module further includes a fluid supply to introduce pressurized fluid into the vacuum generator, and an exhaust to exhaust fluid from the vacuum generator. The vacuum generator includes at least one vacuum ejector adapted to create the vacuum. The vacuum plenum module is further configured to move between a first position in which the vacuum plenum is spaced away from the stencil and a second position in which the vacuum plenum engages the stencil. A method of cleaning a stencil is further disclosed.

Method And Apparatus For Supporting And Clamping A Substrate

US Patent:
7121199, Oct 17, 2006
Filed:
Oct 18, 2004
Appl. No.:
10/967450
Inventors:
Joseph A. Perault - Natick MA, US
James Lynch - Uxbridge MA, US
Assignee:
Speedline Technologies, Inc. - Franklin MA
International Classification:
B05C 17/06
US Classification:
101126, 101127, 101129, 118213
Abstract:
A stencil printer for printing viscous material on a substrate includes a frame, a stencil coupled to the frame, and a print head, coupled for the frame, to deposit and print viscous material over the stencil. The stencil printer further includes a substrate supporting and clamping assembly to support and clamp a substrate in a print position. The substrate supporting and clamping assembly includes at least one support member to support the substrate in a print position, a pair of rail members, coupled to the frame, adapted to engage opposite edges of the substrate, and a clamping mechanism, coupled to the frame, to move at least one of the rail members against the substrate to clamp the substrate. The clamping mechanism includes at least one piston to move the at least one of the rail members between a first position in which the rail member is spaced away from one of the opposite edges of the substrate and a second position in which the rail member engages one of the opposite edges of the substrate to clamp the substrate between the rail members during a print operation. The clamping mechanism further includes a pressure regulator to control a clamping force applied by the piston to the rail member against the edge of the substrate.

Electronic Substrate Printing

US Patent:
7293691, Nov 13, 2007
Filed:
Jan 17, 2003
Appl. No.:
10/346803
Inventors:
Mark Rossmeisl - Franklin MA, US
Joseph A. Perault - Natick MA, US
Assignee:
Speedline Technologies, Inc. - Franklin MA
International Classification:
B23K 31/00
B05D 5/12
US Classification:
2282481, 427 961
Abstract:
A system for depositing solder paste on a print window of a printed circuit board through a stencil includes a housing providing a printing chamber, a depositor configured to move relative to the housing and to deposit the solder paste, a support device disposed in the printing chamber and configured to receive the circuit board and to selectively hold the circuit board stationary relative to the housing, a loading mechanism configured to receive the circuit board and to transport the circuit board along a second direction to the support device, a controller coupled and configured to control dispensing of the solder paste by the depositor and the transporting of the circuit board by the loading mechanism, and a rotational apparatus coupled to the support device and configured to rotate the support device, where the controller is configured to cause the rotational apparatus to rotate the support device more than about 10 and to cause the depositor to deposit solder paste onto the circuit board after the rotational device has rotated the support device more than about 10.

Method And Apparatus For Clamping A Substrate

US Patent:
7549371, Jun 23, 2009
Filed:
Jul 10, 2006
Appl. No.:
11/483493
Inventors:
Richard Willshere - Weymouth, GB
Joseph A. Perault - Natick MA, US
James Lynch - Uxbridge MA, US
Mark E. Rossmeisl - Franklin MA, US
Assignee:
Speedline Technologies, Inc. - Franklin MA
International Classification:
B05C 17/08
US Classification:
101126, 101123
Abstract:
A stencil printer for printing viscous material on a substrate includes a frame, a stencil coupled to the frame, and a print head, coupled for the frame, to deposit and print viscous material over the stencil. The stencil printer further includes a substrate support to support a substrate in a print position and a substrate clamping assembly to clamp the substrate in the print position. In a certain embodiment, the substrate clamping assembly includes a pair of rail members coupled to the frame. The rail members are adapted to engage opposite edges of the substrate. The substrate clamping assembly further includes a pair of foils, one for each rail member, with each foil being releasably secured to the rail member in a position so that the foil overlies the substrate. The substrate clamping assembly also includes a pair of clamping members, one for each rail member and foil, to releasably secure the foil in place on the rail member.

Method And Apparatus For Placing Substrate Support Components

US Patent:
2009020, Aug 20, 2009
Filed:
Feb 14, 2008
Appl. No.:
12/031008
Inventors:
Joseph A. Perault - Natick MA, US
Steven R. Foster - Norfolk MA, US
Assignee:
ILLINOIS TOOL WORKS INC. - Glenview IL
International Classification:
B05C 11/00
G06K 9/00
US Classification:
118713, 382145
Abstract:
An apparatus for depositing viscous material on an electronic substrate includes a frame, a unit coupled to the frame, the unit being configured to deposit material on the electronic substrate, and a substrate support assembly coupled to the frame. The substrate support assembly is configured to support the electronic substrate. The substrate support assembly includes a plurality of support elements, a table coupled to the frame, the table having a support surface to support at least one support element of the plurality of support elements, a placement head configured to releasably secure the at least one support element, and a transport device coupled to the frame and the placement head. The transport device is configured to move the placement head relative to the table in both X and Y directions to place the at least one support element on the support surface of the table in a predetermined position. The apparatus further includes an imaging system coupled to the frame and a controller coupled to the imaging system. The imaging system is configured to capture images of the support surface of the table. The controller is configured to verify whether the at least one support element is placed on the predetermined position on the support surface of the table based on images captured by the imaging system. Other embodiments of the apparatus and related methods are further disclosed.

Method And Apparatus For Placing Substrate Support Components

US Patent:
2009030, Dec 10, 2009
Filed:
Jun 9, 2009
Appl. No.:
12/480901
Inventors:
Joseph A. Perault - Natick MA, US
Steven R. Foster - Norfolk MA, US
Assignee:
ILLINOIS TOOL WORKS INC. - Glenview IL
International Classification:
B05C 17/08
US Classification:
101126
Abstract:
A stencil printer for printing material on a substrate includes a frame, a stencil coupled to the frame, and a substrate support assembly coupled to the frame. The substrate support assembly is configured to support the substrate. A print head gantry is coupled to the frame. The print head gantry is configured to move with respect to the frame in one of an x-axis and a y-axis direction. A print head is coupled to the print head gantry. The print head is configured to print material on the substrate through the stencil. An imaging gantry is coupled to the frame and is disposed between the stencil and the substrate support assembly. The imaging gantry is configured to move with respect to the frame in x-axis and y-axis directions. An imaging system, which is coupled to the imaging gantry, is configured to capture images of at least one of the stencil and the substrate when supported by the substrate support assembly. A device is coupled to the imaging gantry and is configured to perform a secondary operation. Methods of printing material are further disclosed.

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