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Pavan GuptaUnion City, CA

Pavan Gupta Phones & Addresses

Union City, CA   

Milpitas, CA   

Work

Company: Cisco systems May 2006 Position: Principal member of technical staff

Education

School / High School: Clemson Univ. / CSU Dec 2000 Specialities: M.S. in Computer Science
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Career records & work history

Medicine Doctors

Pavan K. Gupta

Specialties:
Cardiovascular Disease
Work:
Cardiology ConsultantsPrairie Cardiovascular
340 W Lincoln St STE 400, Belleville, IL 62220
618-2336044 (phone) 618-2335195 (fax)
Site
HSHS Medical Group
12860 Troxler Ave FL 3, Highland, IL 62249
618-6512750 (phone) 618-6546462 (fax)
Education:
Medical School
University of Pittsburgh School of Medicine
Graduated: 2004
Procedures:
Cardiac Stress Test, Cardioversion, Continuous EKG, Echocardiogram, Electrocardiogram (EKG or ECG)
Conditions:
Acute Myocardial Infarction (AMI), Atrial Fibrillation and Atrial Flutter, Cardiac Arrhythmia, Disorders of Lipoid Metabolism, Heart Failure, Hypertension (HTN), Ischemic Heart Disease, Acute Renal Failure, Alcohol Dependence, Anemia, Angina Pectoris, Anxiety Phobic Disorders, Aortic Valvular Disease, Atherosclerosis, Benign Prostatic Hypertrophy, Breast Disorders, Bronchial Asthma, Cardiomyopathy, Chronic Renal Disease, Conduction Disorders, Diabetes Mellitus (DM), Diverticulitis, Erectile Dysfunction (ED), Fractures, Dislocations, Derangement, and Sprains, Gastroesophageal Reflux Disease (GERD), Gastrointestinal Hemorrhage, Gout, Hallux Valgus, Ischemic Stroke, Malignant Neoplasm of Colon, Mitral Valvular Disease, Multiple Sclerosis (MS), Obstructive Sleep Apnea, Osteoarthritis, Overweight and Obesity, Paroxysmal Supreventricular Tachycardia (PSVT), Pneumonia, Prostate Cancer, Pulmonary Embolism, Septicemia, Substance Abuse and/or Dependency, Transient Cerebral Ischemia, Valvular Heart Disease, Venous Embolism and Thrombosis
Languages:
English, Spanish
Description:
Dr. Gupta graduated from the University of Pittsburgh School of Medicine in 2004. He works in Belleville, IL and 1 other location and specializes in Cardiovascular Disease. Dr. Gupta is affiliated with HSHS St Josephs Hospital and St Elizabeths Hospital.

Pavan Gupta resumes & CV records

Resumes

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Pavan Gupta

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Pavan Gupta

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Vice President, Operations At Sitime

Position:
Vice President, Operations at SiTime
Location:
San Francisco Bay Area
Industry:
Semiconductors
Work:
SiTime - Sunnyvale, CA since Aug 2012
Vice President, Operations SiTime Jul 2005 - Oct 2012
Director, Package and Test Engineering FormFactor Feb 2003 - Jun 2005
Sr Manager, Probe Head Manufacturing Engineering C Speed Jul 2000 - Feb 2003
Director, Optics and Package Engineering IBM May 1997 - Aug 1999
Engineer
Education:
Stanford University 1998 - 2000
MSME, Mechanical Engineering University of California, Los Angeles 1992 - 1997
BSME, Mechanical Engineering
Pavan Gupta Photo 36

Pavan Gupta

Location:
United States
Pavan Gupta Photo 37

Pavan Gupta

Location:
United States
Pavan Gupta Photo 38

Pavan Gupta

Pavan Gupta Photo 39

Pavan Gupta

Pavan Gupta Photo 40

Pavan Gupta

Publications & IP owners

Us Patents

Stacked Die Package For Mems Resonator System

US Patent:
8022554, Sep 20, 2011
Filed:
Jun 15, 2007
Appl. No.:
11/763801
Inventors:
Pavan Gupta - Belmont CA, US
Eric Razda - San Jose CA, US
Assignee:
SiTime Corporation - Sunnyvale CA
International Classification:
H01L 23/48
H01L 23/34
US Classification:
257777, 257666, 257784, 257728, 257E23141
Abstract:
A stacked die package for an electromechanical resonator system includes a chip that contains an electromechanical resonator bonded onto the control chip for the electromechanical resonator by a thermally and/or electrically conductive epoxy. In various embodiments, the electromechanical resonator can be a micro-electromechanical system (MEMS) resonator or a nano-electromechanical system (NEMS) resonator. Packaging configurations that may include the chip that contains the electromechanical resonator and the control chip include chip-on-lead (COL), chip-on-paddle (COP), and chip-on-tape (COT) packages. The stacked die package provides small package footprint and/or low package thickness, as well as low thermal resistance and a robust conductive path between the chip that contains the electromechanical resonator and the control chip.

Stacked Die Package For Mems Resonator System

US Patent:
8324729, Dec 4, 2012
Filed:
Jun 2, 2011
Appl. No.:
13/151316
Inventors:
Pavan Gupta - San Mateo CA, US
Aaron Partridge - Cupertino CA, US
Markus Lutz - Mountain View CA, US
Assignee:
SiTime Corporation - Sunnyvale CA
International Classification:
H01L 23/34
H01L 23/495
US Classification:
257728, 257777, 257784, 257666, 257E23031, 257E23141
Abstract:
A stacked die package for an electromechanical resonator system includes a chip that contains an electromechanical resonator bonded onto the control chip for the electromechanical resonator by a thermally and/or electrically conductive epoxy. In various embodiments, the electromechanical resonator can be a micro-electromechanical system (MEMS) resonator or a nano-electromechanical system (NEMS) resonator. Packaging configurations that may include the chip that contains the electromechanical resonator and the control chip include chip-on-lead (COL), chip-on-paddle (COP), and chip-on-tape (COT) packages. The stacked die package provides small package footprint and/or low package thickness, as well as low thermal resistance and a robust conductive path between the chip that contains the electromechanical resonator and the control chip.

Apparatus And Method For Fabricating Scalable Optical Fiber Cross-Connect Core

US Patent:
2002017, Nov 21, 2002
Filed:
Mar 19, 2002
Appl. No.:
10/102531
Inventors:
Pavan Gupta - Palo Alto CA, US
William Cushman - Santa Barbara CA, US
International Classification:
G02B006/35
G02F001/295
G02B006/32
US Classification:
385/016000, 385/008000, 385/033000
Abstract:
An optical switching core is disclosed that includes a plurality of beam directing devices coupled to a substrate for redirecting a plurality of incoming optical beams to at least one of a plurality of output ports. The substrate includes a plurality of electrical conductors electrically coupled to the plurality of beam directing devices. A low density interconnect is coupled to the conductive traces along a periphery of the substrate to interface drive electronics with the plurality of beam directing devices

Micromirror With Rib Reinforcement

US Patent:
2005016, Jul 28, 2005
Filed:
Jan 22, 2004
Appl. No.:
10/764018
Inventors:
Paul Hagelin - Saratoga CA, US
Pavan Gupta - Belmont CA, US
Gregory Andronaco - Palo Alto CA, US
International Classification:
G02B007/182
US Classification:
359872000, 359224000
Abstract:
The invention provides a micromirror for directing a beam of light. The micromirror includes a mirror plate movably coupled to a substrate and a lower reinforcement rib connected to a lower surface of the mirror plate. The lower reinforcement rib is formed in a rib trench within the substrate when at least a portion of the mirror plate is formed. The lower reinforcement rib reinforces the mirror plate to minimize mirror plate curvature. A system for directing a beam of light and a method of fabricating a reinforced micromirror is also disclosed.

Large Cavity Wafer-Level Package For Mems

US Patent:
2005018, Aug 25, 2005
Filed:
Feb 25, 2004
Appl. No.:
10/787509
Inventors:
Pavan Gupta - Belmont CA, US
Paul Hagelin - Saratoga CA, US
Gregory Andronaco - Palo Alto CA, US
International Classification:
H01L033/00
US Classification:
257098000, 257434000
Abstract:
The invention provides a wafer-level package for a micromirror array. The wafer-level package includes a substrate including a wafer having a substrate surface with a plurality of actuatable micromirrors coupled to the substrate surface. An optical window is attached to the substrate surface to form at least one sealed cavity between an inner surface of the optical window and the substrate surface. A beam of light transmitted through the optical window is redirected by at least one actuatable micromirror within the sealed cavity.

Wafer Encapsulated Microelectromechanical Structure And Method Of Manufacturing Same

US Patent:
2007017, Jul 26, 2007
Filed:
Nov 6, 2006
Appl. No.:
11/593500
Inventors:
Aaron Partridge - Cupertino CA, US
Markus Lutz - Los Altos CA, US
Pavan Gupta - Belmont CA, US
International Classification:
H01L 31/0312
US Classification:
257 77
Abstract:
There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.

Wafer Encapsulated Microelectromechanical Structure And Method Of Manufacturing Same

US Patent:
2007017, Jul 26, 2007
Filed:
Nov 16, 2006
Appl. No.:
11/600460
Inventors:
Aaron Partridge - Cupertino CA, US
Markus Lutz - Los Altos CA, US
Pavan Gupta - Belmont CA, US
International Classification:
H01L 31/0312
US Classification:
257 77
Abstract:
There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.

Wafer Encapsulated Microelectromechanical Structure And Method Of Manufacturing Same

US Patent:
2007017, Jul 26, 2007
Filed:
Nov 16, 2006
Appl. No.:
11/600860
Inventors:
Aaron Partridge - Cupertino CA, US
Markus Lutz - Los Altos CA, US
Pavan Gupta - Belmont CA, US
International Classification:
H01L 31/0312
US Classification:
257 77
Abstract:
There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.

Possible Relatives

David Gupta  Dalip K Gupta  Aakash Gupta  Deborah F Gupta  Deep S Gupta  Deepa Gupta  Deepti Gupta  Pavan Patel  Pavan K Maddali  Pavan Irukulla 

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