Pramod K Patel, 672401 Novona Pl, Oklahoma City, OK 73170

6373126, Apr 16, 2002

Apr 26, 2000

09/560253

Pramod Patel - San Jose CA
Richard C. Blish - Saratoga CA

Advanced Micro Devices, Inc. - Sunnyvale CA

H01L 23495

257666, 257676, 438123

Barrier structures are included within the packaging material of a packaged semiconductor device, such barrier structures including barrier bodies which overlie the die-die pad assembly of the device on either side thereof. The barrier bodies act as baffles which limit diffusion of moisture through the packaging material into the area of the die-die pad assembly of the device, the barrier bodies including apertures therethrough which control such diffusion in a manner that avoids delamination problems in the area of the die-die pad assembly, meanwhile also avoiding undesirable trapping of gas within the packaging material.

6548881, Apr 15, 2003

Jul 25, 2000

09/624657

Richard C. Blish - Saratoga CA
Pramod D. Patel - San Jose CA
David E. Lewis - Sunnyvale CA
Colin D. Hatchard - Campbell CA

Advanced Micro Devices, Inc. - Sunnyvale CA

H01L 2900

257499, 257 48

Method for stepping identification and bond pad crater jeopardy identification in integrated circuits and apparatus which performs the method, A unique device, a polysilicon meander, is formed under each bond pad in the integrated circuit device. Connected to the meander is circuitry for determining the electrical, and hence mechanical, integrity of the meander. Failure of the meander by reason of microcrack formation in the several layers under the meander is detected by the high resistance of the meander. The circuitry will also resolve any potential mismatch between the actual mask revision of the integrated circuit and the corresponding revision of the test program.

2022025, Aug 11, 2022

Apr 22, 2022

17/727470

- Philadelphia PA, US
Chris DECENZO - Menlo Park CA, US
Pramod PATEL - Redwood City CA, US
Ken SUNDERMEYER - Palo Alto CA, US

H04L 41/22
H04L 67/125
G06F 3/0488

A system and methods comprise a touchscreen at a premises. The touchscreen includes a processor coupled to a security system at the premises. User interfaces are presented via the touchscreen and include a security interface that provides control of functions of and access to data collected by the security system, and a network interface that provides access to network devices. A plurality of network devices at the premises is coupled to the touchscreen. A security server at a remote location is coupled to the touchscreen. The security server comprises a client interface through which remote client devices exchange data with the touchscreen and the security system. The client interface is a cross-client interface provided by a client view model of at least one of the touchscreen and the security server that normalizes information of the plurality of network devices and the security system.

2020034, Oct 29, 2020

Mar 2, 2020

16/807100

- Philadelphia PA, US
Chris DECENZO - Menlo Park CA, US
Pramod PATEL - Redwood City CA, US
Ken SUNDERMEYER - Redwood City CA, US

H04L 12/24
G06F 3/0488
H04L 29/08

A system and methods comprise a touchscreen at a premises. The touchscreen includes a processor coupled to a security system at the premises, User interfaces are presented via the touchscreen and include a security interface that provides control of functions of and access to data collected by the security system, and a network interface that provides access to network devices. A plurality of network devices at the premises is coupled to the touchscreen. A security server at a remote location is coupled to the touchscreen. The security server comprises a client interface through which remote client devices exchange data with the touchscreen and the security system. The client interface is a cross-client interface provided by a client view model of at least one of the touchscreen and the security server that normalizes information of the plurality of network devices and the security system.