Inventors:
Kenneth Dean - Phoenix AZ, US
Bernard F. Coll - Fountain Hills AZ, US
Allison M. Fisher - Chandler AZ, US
Carl R. Hagen - Chandler AZ, US
Michael Hupp - Gilbert AZ, US
James E. Jaskie - Scottsdale AZ, US
Scott V. Johnson - Scottsdale AZ, US
Thomas Shellberg - Chandler AZ, US
Stephen L. Spanoudis - Coral Springs FL, US
Ryan M. Froyd - Sunrise FL, US
Steven R. Young - Gilbert AZ, US
Assignee:
MOTOROLA, INC. - Schaumburg IL
International Classification:
C09J 5/00
Abstract:
A method for forming a housing for an electronic device () includes providing a first rigid layer () including a curved surface defining a cavity (). A first adhesive () is optionally applied over the curved surface, and an electro-optic module () having a flexible substrate and a viewable surface (), is conformally fitted on the first adhesive (). A second adhesive () is optionally disposed over the electro-optic module () and a support structure () is optionally placed on the second adhesive (). The support structure () includes an attachment apparatus () for mounting electronic circuitry. The first and second adhesives () are cured. One of the second adhesive () or both the first rigid layer () and the first adhesive () are transparent for viewing a viewable surface () on or coupled to the electro-optic module ().
