Vincent Chen, 39Portland, OR

7009891, Mar 7, 2006

May 19, 2005

11/132335

Vincent Chen - Newport Coast CA, US
Henry Chen - Irvine CA, US
Liming Tsau - Irvine CA, US
Jay Shiau - Irvine CA, US
Surya Battacharya - Irvine CA, US
Akira Ito - Irvine CA, US

Broadcom Corporation - Irvine CA

H01L 29/00
G11C 7/00

36518901, 257530, 257532, 438131, 438467, 438600, 3652257

A one-time programming memory element, capable of being manufactured in a 0. 13 μm or below CMOS technology, having a capacitor, or transistor configured as a capacitor, with an oxide layer capable of passing direct gate tunneling current. Also included is a write switch, having first and second switches coupled to the capacitor, and a read switch also coupled to the capacitor. The capacitor/transistor is one-time programmable as an anti-fuse by application of a program voltage across the oxide layer via the write switch to cause direct gate tunneling current to rupture the oxide layer to form a conductive path having resistance of approximately hundreds of ohms or less.

8010912, Aug 30, 2011

Mar 7, 2008

12/073685

Vincent Chen - Newport Beach CA, US
Vahid Manian - Coto de Caza CA, US

Broadcom Corporation - Irvine CA

G06F 17/50

716 50, 716 51, 716 52, 716 53, 716 54, 716 55, 716 56

Provided is a method to design an integrated circuit. The method reduces a time delay between introduction of a new lithography process and a start of production. A first semiconductor mask is designed at a first process feature size. The first process feature size can be based on an anticipated process feature size of the new lithography process. A second semiconductor mask is created by enlarging the first semiconductor mask to a second process feature size for which production is available. Thus, the second process feature size is larger than the first process feature size. An integrated circuit (IC) is fabricated with the second semiconductor mask. After the new semiconductor process has been developed and is available for production, another IC is fabricated with the first semiconductor mask.

2010026, Oct 21, 2010

Aug 3, 2009

12/534773

Curt Morgan - Huntington Beach CA, US
Vincent Chen - Westminster CA, US

A47J 31/00
A47J 31/44

99295, 99300

The present invention is a coffee brewer that uses a one time use, prepackaged, disposable gas propellant capsule to force hot water through ground coffee to create brewed coffee or espresso.

5413490, May 9, 1995

Oct 26, 1993

8/142769

Frank C. Ma - Diamond Bar CA
Vincent S. Chen - Walnut CA

Genrife Company Limited

H01R 909

439 76

An I/O card assembly (1) is provided having an insulative frame means (10, 40) sandwiched by a pair of generally similar conductive covers (50, 70). Each cover (50) includes a main plate (52) and two elongated side shielding walls (56) downward extending from two opposite sides of the plate (52) a first distance which is generally half of a height of the side wall (12) of the frame (10). A groove (18) horizontally extends along the center line of side wall (12) of the frame (10) for receiving both the hook sections (58) which are respectively inwardly formed at the outermost edges of the side shielding walls (56) of the top and the bottom covers (50, 70). Between the top and the bottom covers (50, 70), an internal PC board (80) is seated on the frame whereby two connectors (90, 100) are respectively soldered on two opposite end regions of the PC board (80) and respectively retained at two opposite ends of the main frame (10) and therefore, the PC board (80) and the two associated connectors (90, 100) are appropriately held in position in the card assembly (1) for mating with the corresponding electrical devices.

5451158, Sep 19, 1995

Oct 26, 1993

8/143852

Yuan C. Lin - El Toro CA
Vincent Chen - Walnut CA

Foxconn International, Inc. - Sunnyvale CA

H01R 909

439 79

A "through-hole mounting" boardlock fixture is adapted to secure an electrical connector to a Printed Circuit Board (PCB) employing a Surface Mounting Technology (SMT) procedure. In one aspect, the boardlock fixture comprises a rim defining an opening therethrough and a solder block dimensioned to be insertable within the opening. Furthermore, a plurality of fingers flexibly mounted to the rim extend, generally, downward therefrom. Each respective finger is dimensioned to support the boardlock when inserted in the opening. SMT is applied to melt the solder block to mount the connector to the PCB. In another aspect of the present invention, an electrical connector including a housing is mounted to a PCB. Further, the housing defines a row of apertures each of which a respective pin contact is positioned therein. Each pin contact includes a downward extension extending along a housing back region which terminates at a corresponding PCB circuit.

5281166, Jan 25, 1994

Oct 28, 1991

7/783189

Nobbert Yu - Culver City CA
Yuan C. Lin - El Toro CA
Vincent Chen - Walnut CA

Foxconn International, Inc. - Sunnyvale CA

H01R 1300

439571

A "through-hole mounting" boardlock fixture is adapted to secure an electrical connector to a Printed Circuit Board (PCB) employing a Surface Mounting Technology (SMT) procedure. In one aspect, the boardlock fixture comprises a rim defining an opening therethrough and a solder block dimensioned to be insertable within the opening. Furthermore, a plurality of fingers flexibly mounted to the rim extend, generally, downward therefrom. Each respective finger is dimensioned to support the boardlock when inserted in the opening. SMT is applied to melt the solder block to mount the connector to the PCB. In another aspect of the present invention, an electrical connector including a housing is mounted to a PCB. Further, the housing defines a row of apertures each of which a respective pin contact is positioned therein. Each pin contact includes a downward extension extending along a housing back region which terminates at a corresponding PCB circuit.

5145412, Sep 8, 1992

Oct 18, 1991

7/779538

Nobbert Yu - Culver CA
Yuan-Chieh Lin - El Toro CA
Vincent Chen - Walnut CA

Foxconn International, Inc. - Sunnyvale CA

H01R 1366

439620

A housing has a hollow portion to receive a ferrule, and a support member is positioned between the housing and the ferrule. A plurality of electrical elements are selectively positioned within the housing in electrically conductive contact with the support member. A detachable shell is closely positioned on the housing in circumscribing relation with the support member and in electrically conductive relation with the electrical elements to completely shield and enclose the electrical elements. Removing the electrical elements, the rest parts of the assembly is deemed as a semi-finished product and can be stored as inventory for a later time use according to the customer's requirements.

5490043, Feb 6, 1996

Apr 15, 1994

8/228141

Vincent Chen - Walnut CA
Frank C. Ma - Diamond Bar CA

Hon Hai Precision Ind. Co., Ltd.

H05K 900

361818

An I/O card (1) includes a rectangular frame (10) sandwiched between a top cover (11) and a bottom cover (13). Connector means (16, 18) are positioned at the ends of the I/O card (1) to form an in-and-out interface, and is mounted on a PC board (28) in the I/O card (1). A pair of top and bottom grounding clips (40, 30) are respectively attached on two opposite sides of the frame (10) and electrically and mechanically engage the top surface (29) and the bottom surface (27) of the inner PC board (28), respectively, wherein both grounding clips (30, 40) can be pre-assembled with the frame (10) and the bottom cover (13) as a semi-finished product which is delivered to an I/O card manufacturer who assembles the internal PC board (28) and the associated interface connectors (16, 18) to such pre-assembly without any interference from either of the grounding clips (30, 40) and successively places a top cover (11) thereon to complete the final product. In this situation, the top grounding clip (40) can be deformably depressed downward by the top cover (11) to electrically and mechanically contact the top surface (29) of the internal PC board (28) for grounding.